Interview with GlobalFoundries VP at MIPS ‘Physical AI is Agentic AI at the Edge’ Taipei Event

At the MIPS event in Taipei, EE Times interviewed Sudipto Bose, Vice President of FDSOl product line at GlobalFoundries. The discussion centered on the rise of Physical AI and Agentic AI at the edge. ... Read original →

GlobalFoundries’ framing of Physical AI as edge-deployed Agentic AI signals a strategic pivot from cloud-centric to device-native intelligence. Technologically, its integrated portfolio—spanning silicon photonics, RF/power GaN, and AMS—enables sensor-compute-communication convergence, accelerating domain-specific SoC adoption. Regulatory risks loom: while MIPS/ARC integration mitigates RISC-V fragmentation, tightening U.S. export controls could inflate manufacturing costs in Taiwan, China. Competitively, TSMC may counter with CoWoS-L packaging enhancements for edge AI, and Intel will likely push Loihi 2 neuromorphic chips. Over the next 12–24 months, edge AI hardware will bifurcate into ultra-low-power inference and real-time control segments—areas where GF’s FD-SOI platform and embedded IP position it to dominate industrial robotics and autonomous perception layers.