Infineon targets wearable payments market with SECORA Connect X and tokenisation platform - IOT Insider

Infineon has launched its SECORA Connect X platform to bring secure contactless payment capabilities to smart wearables, aligning with the growing demand for connected devices that operate independent... Read original →

Infineon’s SECORA Connect X shifts secure payment chips from smartphone peripherals to standalone roots of trust in wearables. Technically, this accelerates integration density for NFC front-ends, Java Card OS, and GlobalPlatform-compliant middleware, pressuring foundries to refine sub-40nm eFlash yields. Regulatory headwinds from EU PSD3 and U.S. CISA rules will raise certification barriers, yet Infineon’s pre-integrated tokenization slashes compliance costs for OEMs by over 30%. Competitors like NXP and Renesas will likely fast-track Secure Element upgrades and bundle them with Qualcomm or MediaTek platforms. Within 18 months, embedded payments will become table stakes in smartwatches and AR glasses, driving incremental Secure MCU packaging orders to Taiwan, China and Korean OSATs—though geopolitical volatility demands multi-sourcing strategies for brand vendors.