Semiconductor News & Analysis Feed
20 articles
2026-05-27
www.techtimes.com
2026-05-27
SK hynix unveiled its innovative iHBM (Integrated High Bandwidth Memory) technology on May 26, 2026, addressing a persistent performance bottleneck in high-bandwidth memory (HBM) used in AI data centers. By embedding proprietary cooling elements directly within the HBM package at the die-to-die phys
2026-05-27
www.techtimes.com
2026-05-27
SK hynix announced its innovative iHBM (Integrated High Bandwidth Memory) technology on May 26, 2026, which reduces thermal resistance by over 30% by embedding proprietary cooling elements directly within the HBM package. This breakthrough addresses persistent heat buildup in AI data center hardware
2026-05-27
www.communicationstoday.co.in
2026-05-27
SK hynix unveiled its new 'iHBM' thermal management technology on May 26, 2026, aimed at addressing heat dissipation challenges in high-bandwidth memory (HBM) products operating at increasingly higher speeds. The key innovation is the embedded ICE component, which uses high thermal conductivity sili
2026-05-27
www.igorslab.de
2026-05-27
SK hynix has introduced iHBM, a new thermal management solution aimed at addressing the growing heat dissipation challenges in future High Bandwidth Memory (HBM) applications, particularly in AI accelerators, HPC systems, and dense server platforms. Unlike traditional approaches that rely on indirec
2026-05-27
www.igorslab.de
2026-05-27
SK hynix has introduced iHBM, a new thermal solution for High Bandwidth Memory (HBM) that integrates cooling directly into the memory package. As HBM stacks become denser and data rates increase, power density rises, creating a critical thermal bottleneck. Traditional designs rely on indirect heat d
2026-05-27
www.thelec.net
2026-05-27
SK hynix unveiled its new 'iHBM' thermal management technology on May 26, aimed at addressing escalating heat issues in high-bandwidth memory (HBM) products operating at higher speeds. The key innovation is the embedded ICE component, made of high thermal conductivity silicon, positioned directly ab
2026-05-27
www.mk.co.kr
2026-05-27
SK hynix has unveiled a new iHBM technology designed to significantly reduce heat generation in high bandwidth memory (HBM), a critical component in AI semiconductors. As performance demands increase, thermal challenges in HBM have become a major bottleneck. The company embedded Integrated Cooling E
2026-05-26
www.chosun.com
2026-05-26
SK Hynix unveiled its 'iHBM' technology on May 26, 2026, designed to significantly reduce heat generation in high-bandwidth memory (HBM) used in AI accelerators. As AI computing demands rise, HBM chips face increasing thermal loads, leading to performance degradation. The iHBM incorporates an integr
2026-05-26
www.tomshardware.com
2026-05-26
2026-05-26
en.bloomingbit.io
2026-05-26
2026-05-26
overclock3d.net
2026-05-26
2026-05-26
cryptobriefing.com
2026-05-26
2026-05-26
videocardz.com
2026-05-26
2026-05-26
letsdatascience.com
2026-05-26
2026-05-26
www.koreatimes.co.kr
2026-05-26
2026-05-26
www.koreaherald.com
2026-05-26
2026-05-26
www.chosun.com
2026-05-26
2026-05-26
vir.com.vn
2026-05-26
SK hynix has launched its iHBM (integrated high-bandwidth memory) solution to address thermal challenges in next-generation AI memory chips. As demand for AI and high-performance computing grows, HBM technology advances toward higher stacking and faster speeds, intensifying heat dissipation issues.
2026-05-26
www.trendforce.com
2026-05-26
2026-05-26
www.asiae.co.kr
2026-05-26
In the context of the booming artificial intelligence (AI) sector, the semiconductor industry faces a major challenge: heat generation in high-density integrated circuits. SK hynix unveiled its next-generation memory technology, 'iHBM,' on May 26, addressing this issue by embedding a proprietary coo