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SK Siltron is preparing to bring a new silicon wafer manufacturing facility online in South Korea next month. The expansion comes as AI data center investment helps lift wafer shipments, while pricing remains under pressure as capacity added during the last expansion cycle continues to weigh on the market.

Home / Analysis / Texas Instruments (TXN) Has a 300mm-and-Free-Cash-Flow Story Bigger Than a Chip-Cycle Label ANALYSIS Texas Instruments (TXN) Has a 300mm-and-Free-Cash-Flow Story Bigger Than a Chip-Cycle Label $TXN June 22, 2026 6 min read X in f Texas Instruments is still frequently discussed as if it were just another semiconductor-cycle stock: demand softens, inventory corrects, utilization d

ASML, TSMC and imec present 300mm integration route for industry-ready 2D-material-based transistors In partnership with equipment provider Advanced Semiconductor Materials Lithography (ASML) of Veldhoven, The Netherlands and foundry Taiwan Semiconductor Manufacturing Corp (TSMC), nanoelectronics research center imec of Leuven, Belgium has presented a novel, robust and scalable 300mm integration

Tech Industry Manufacturing Semiconductors Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer News-analysis By Luke James published June 19, 2026 EUV-printed 28nm gates and 94% working devices, all on standard production tooling. (Imag

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a step toward moving atomically thin channel materials from laboratory devices closer to semiconductor manufacturing.

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly

Headline ASML, TSMC and Imec scale 2D transistors to 50nm pitch on 300mm wafers 15 June 2026 Paul van Gerven Editor at Bits&Chips Reading time: 1 minute ASML, TSMC and Imec have demonstrated a scalable 300mm manufacturing flow for 2D-material transistors, marking a step toward industrial adoption of post-silicon logic devices. Presented at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circu

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