Semiconductor News & Analysis Feed

China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure.

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.

Warpage, heat, and brittleness can cause huge reliability problems for expensive designs.

Power electronics reliability and packaging materials are explored with Henkel’s Burcak Conley in a PowerUP interview discussion.