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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
Electronics Media
ROHM TSC3PAK SiC MOSFET Package Enables High-Efficiency Power Design for EVs
By Electronics Media -
June 9, 2026
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ROHM TSC3PAK SiC MOSFET Package – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product
2026-06-09
evertiq.com
2026-06-09
Evertiq
© Siemens
Business | June 09, 2026
Siemens partners with Samsung Foundry to advance silicon design
Evertiq
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.
Siemens has announced the lates
2026-06-09
analyticsindiamag.com
2026-06-09
Analytics India Magazine
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2026-06-09
www.eenewseurope.com
2026-06-09
eeNews Europe
Microchip has introduced 3.3 kV HV-D3 mSiC power modules aimed at solid-state transformer designs for AI data centres and other high-voltage power systems. The modules integrate 3.3 kV SiC MOSFETs and Schottky diodes in a standard 62 mm package.
The news is relevant for eeNews Europe readers because power delivery is becoming a limiting factor in AI infrastructure. It also points to how SiC devic
2026-06-09
www.digitimes.com
2026-06-09
digitimes
Onsemi has introduced an online design tool to help engineers match SiC MOSFETs and gate drivers more quickly. The company said the platform could reduce early-stage trial-and-error in power electronics, with potential implications for AI data centers,...
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after a prolonged downturn.
2026-06-09
www.bloomberg.com
2026-06-09
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digitimes.com
2026-06-09
Onsemi has introduced an online design tool to help engineers match SiC MOSFETs and gate drivers more quickly. The company said the platform could reduce early-stage trial-and-error in power electronics, with potential implications for AI data centers, electric vehicles, industrial systems, and electrification infrastructure worldwide.
2026-06-09
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2026-06-09
01net
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2026-06-09
Bloomberg Law News
Redstone filed a federal lawsuit accusing chip maker Qualcomm of making and selling products that infringe on its patent for a specific method of communication between processor cores in a multi-core processor.
Redstone Logics LLC previously sued Qualcomm Inc. and Qualcomm Technologies Inc., alleging patent infringement for its implementation of ARM’s processor architecture in a September 2024 la
2026-06-09
news.bloomberglaw.com
2026-06-09
Bloomberg Law News
Redstone filed a federal lawsuit accusing chip maker Qualcomm of making and selling products that infringe on its patent for a specific method of communication between processor cores in a multi-core processor.
Redstone Logics LLC previously sued Qualcomm Inc. and Qualcomm Technologies Inc., alleging patent infringement for its implementation of ARM’s processor architecture in a September 2024 la
2026-06-09
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2026-06-09
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Reuters
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Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs
Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs
RefinitivLess than 1 min read
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