Semiconductor News & Analysis Feed
85 articles
2026-07-08
tomshardware.com
2026-07-08
Anton Shilov
SPHBM4 promises HBM4-class bandwidth without usage of silicon interposer and CoWoS-like packaging.
2026-07-08
digitimes.com
2026-07-08
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
2026-07-07
www.cnbc.com
2026-07-07
CNBC
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2026-07-06
digitimes.com
2026-07-06
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first commercial move into the market. The deal highlights rising demand for advanced chip-making chemicals as artificial intelligence, high-bandwidth memory, and smaller device designs reshape global semiconductor manufacturing.
2026-07-06
digitimes.com
2026-07-06
Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion) investment aimed at increasing production of advanced memory chips, particularly high-bandwidth memory (HBM) used in artificial intelligence (AI) processors.
2026-07-06
digitimes.com
2026-07-06
The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.
2026-07-05
digitimes.com
2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
digitimes.com
2026-07-05
Surging demand for high-bandwidth memory (HBM) used in AI servers has driven shortages and sharp price increases for conventional memory, while microcontroller (MCU) suppliers have also begun passing higher costs on to customers. Apple raised prices for certain Mac and iPad models in late June, and market rumors suggest the upcoming iPhone 18 could see price increases of as much as 30%.
2026-07-03
digitimes.com
2026-07-03
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening its bid to gain ground in the AI memory market.
2026-07-02
www.digitaltoday.co.kr
2026-07-02
디지털투데이
AI & Enterprise
Qualcomm unveils 'High Bandwidth Compute' as HBM alternative, enters AI chip race
AI Summary
Qualcomm is stepping up its return to the data centre AI chip market with a new memory architecture using LPDDR instead of high-bandwidth memory (HBM). It unveiled High Bandwidth Compute and plans to launch its AI250 inference accelerator in mid-2027. Qualcomm says the near-memory design c
2026-07-02
digitimes.com
2026-07-02
Memory suppliers are renegotiating high-bandwidth memory contracts, and PC brands say price increases may slow later this year. For global buyers, that relief could be short-lived, as supply-chain sources warn that shortages tied to artificial intelligence demand are likely to keep memory markets tight through 2027.
2026-07-02
www.techradar.com
2026-07-02
TechRadar
Pro
Qualcomm High Bandwidth Compute aims to compete with High Bandwidth Flash and Memory by stacking LPDDR just above the CPU to 'eliminate HBM tax'
News
By Rahim Amir
Published July 2, 2026
Taking the high, stacked LPDDR road?
(Image credit: ServeTheHome)
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2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-06-30
digitimes.com
2026-06-30
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.
2026-06-30
digitimes.com
2026-06-30
Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products
2026-06-29
digitimes.com
2026-06-29
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers also expect Samsung to expand 1c DRAM production for HBM4 while raising the latter's prices in 2027 to boost both market share and profitability.
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-25
www.tomshardware.com
2026-06-25
Tom's Hardware
Tech Industry Artificial Intelligence
Qualcomm reveals HBC near-memory AI architecture, AI250 and AI350 accelerators — touts 6x higher bandwidth-per-watt compared to HBM, 200x capacity compared to on-chip SRAM
News
By Anton Shilov published 22 hours ago
More efficient than HBM, denser than SRAM.
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall. (Image credi
2026-06-25
digitimes.com
2026-06-25
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape, bandwidth per AI rack is set to increase from approximately 130 TB/s in the Blackwell generation to more than 1 PB/s in the Feynman era, spanning Blackwell, Rubin, Rubin Ultra, and Feynman platforms. As a result, the g
2026-06-25
digitimes.com
2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.