Samsung could become HBM market share leader in 2027

Samsung’s HBM4 breakthrough is destabilizing SK hynix’s dominance, leveraging its 1c-node DRAM scale to not only cut advanced packaging costs but also pressure TSMC’s CoWoS ecosystem toward tighter memory-logic integration. However, tightening U.S. export controls on advanced memory and uncertain Korean subsidies could inflate Samsung’s compliance overhead, especially for U.S. and European fabs. In response, SK hynix will likely accelerate co-development of HBM4E with NVIDIA and deepen supply chain ties in Taiwan, China to mitigate disruption risks. Over the next 12–24 months, HBM pricing will bifurcate: top-tier AI chipmakers lock in premium supply, while mid-tier customers face allocation gaps—accelerating market consolidation and squeezing out smaller players.