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China is actively pursuing alternative approaches to chip manufacturing, with SOI Micro recently attracting significant investment, signaling progress toward reducing reliance on foreign technology. The company, based in Guangzhou, is developing a low-power logic process using fully depleted silicon

Semiconductor Investment FD-SOI Technology Chip Manufacturing EUV Alternative Chinese Semiconductor Industry Logic Chips Chip Design Domestic Substitution

[News] GaN Patent Battle Heats Up: Navitas Sues Renesas After Trade-Secret Claims - TrendForce

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www.trendforce.com 2026-08-13

[News] TSMC’s 5.5-Reticle CoWoS Reportedly Tops 99% Yield; Flags Memory, ABF as AI Bottlenecks - TrendForce

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www.trendforce.com 2026-08-11

[News] TSMC, Sony Reportedly Plan JPY 1 Trillion JV for Image Sensors in Kumamoto, Eye 2029 Mass Production - TrendForce

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news.google.com 2026-08-10

[News] Samsung’s HBM4 Yield Reportedly Hits 80% as HBM Race Heats Up, SK hynix Labor Talks Add a Twist - TrendForce

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news.google.com 2026-08-10

[News] China’s Big Fund Phase III Pivot: From Fab-Building to Advanced Packaging, Equipment, and AI Chips - TrendForce

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news.google.com 2026-08-07

[News] TSMC Reportedly Expands Outsourcing of Key CoWoS Front-End Step to OSATs Amid Rising NVIDIA, ASIC Demand - TrendForce

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www.trendforce.com 2026-08-05

TrendForce reports that TSMC is expanding outsourcing of key CoWoS front-end processes to OSATs amid surging demand from NVIDIA and ASIC markets. CoWoS technology is crucial for advanced packaging, particularly for high-performance computing chips used in AI and data center applications. As NVIDIA m

TSMC CoWoS Front-end process Outsourcing NVIDIA ASIC Semiconductor manufacturing OSAT

[News] SK hynix, SanDisk Debut HBF Standard to Challenge AI Memory Bottlenecks with Google, Tenstorrent Support - TrendForce

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www.trendforce.com 2026-08-04

[News] MediaTek Advances 400G SerDes on 2nm, Targeting Google TPU v10 and Meta AI ASIC Orders - TrendForce

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www.trendforce.com 2026-08-03

MediaTek has achieved a significant technological breakthrough in semiconductor development, successfully advancing 400G SerDes technology on 2nm process, targeting major orders from Google's TPU v10 and Meta's AI ASIC. This advancement demonstrates MediaTek's growing capabilities in advanced proces

MediaTek 2nm process SerDes Google TPU Meta AI Semiconductor manufacturing Chip design AI chips

[News] TSMC 3nm Monthly Wafer Starts to Hit 180K by Early 4Q26 on Strong Demand, 2–3 Months Ahead of Expectations - TrendForce

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www.trendforce.com 2026-08-03

[News] TSMC Reportedly Develops EMIB-like Packaging with Kinsus to Prevent Potential Customer Shift to Intel - trendforce.com

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www.trendforce.com 2026-07-31

According to multiple media reports, TSMC is reportedly developing an EMIB-like advanced packaging technology in collaboration with Kinsus, a Taiwan-based IC substrate maker, to prevent customer shifts from its existing CoWoS platform to Intel’s packaging solutions. As TSMC’s CoWoS capacity faces in

TSMC Intel EMIB Advanced Packaging Semiconductor Manufacturing Chip Packaging Kinsus CoWoS

[Insight] NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks, Says TrendForce - LEDinside

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www.ledinside.com 2026-07-29

[News] Chinese Advanced Packaging Firms Kicks-Start a New Round of Capacity Expansion - TrendForce

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www.trendforce.com 2026-07-29

Chinese advanced packaging firms are launching a new round of capacity expansion, reflecting profound changes in the global semiconductor industry landscape. Driven by rapid development in 5G, AI, and IoT technologies, demand for high-performance, highly integrated chips continues to grow, pushing p

Advanced Packaging Capacity Expansion Semiconductor Industry Chinese Semiconductor Packaging and Testing Technology Upgrade Investment Growth Market Expansion

NVIDIA and Broadcom Begin Volume Ramp of CPO Switches, with Optical Engine Yield and Advanced Packaging Capacity Emerging as Key Expansion Bottlenecks, Says TrendForce - TrendForce

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news.google.com 2026-07-27

[News] TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom - TrendForce

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news.google.com 2026-07-27

[News] SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI - TrendForce

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www.trendforce.com 2026-07-24

SK Hynix is reportedly hiring engineers for 3D-stacked DRAM-on-Logic development, signaling a strategic move to support on-device AI applications. This advanced memory architecture integrates DRAM directly on top of system-on-chip (SoC) dies, offering shorter interconnects, higher data I/O channels,

3D-Stacked DRAM DRAM-on-Logic On-Device AI Semiconductor Technology Memory Architecture SK Hynix U.S. Customer Advanced Packaging

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