[News] TSMC Reportedly Develops EMIB-like Packaging with Kinsus to Prevent Potential Customer Shift to Intel - trendforce.com

According to multiple media reports, TSMC is reportedly developing an EMIB-like advanced packaging technology in collaboration with Kinsus, a Taiwan-based IC substrate maker, to prevent customer shift... Read original →

TSMC’s collaboration with Kinsus in developing an EMIB-like packaging solution signals a strategic push to counter Intel’s growing influence in advanced chip packaging. This move is aimed at safeguarding TSMC’s CoWoS leadership amid rising customer attrition risks, particularly from major clients like NVIDIA and Google. Intel’s EMIB-T technology, leveraging silicon bridges for high-density, low-latency interconnects, is entering full-scale production by 2027. Meanwhile, Unimicron’s involvement in ABF substrate supply for EMIB-T underscores the intensifying competition among Taiwan-based suppliers. The evolution of packaging technologies is shifting from platform rivalry to multi-technology convergence, especially in AI and data center chips. If TSMC fails to deliver a differentiated solution, it risks losing key accounts to Intel. Over the next 12–24 months, the trajectory of packaging innovation will shape global semiconductor supply chain dynamics, with Taiwan’s integrated ecosystem playing a pivotal role.