www.ad-hoc-news.de
2026-07-04
Ad-hoc-news.de
Kinsus, TW0003189007
Kinsus Interconnect Tech outlines its role in advanced packaging. The company positions for long-term growth in global chip demand
Veröffentlicht: 04.07.2026 um 13:36 Uhr, Redaktion AD HOC NEWS, Redaktionelle Verantwortung: Rafael Müller (Chefredaktion)
Kinsus Interconnect Tech is a Taiwan-based provider of IC substrates and advanced packaging solutions. The company supplies
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.