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[News] SK hynix Reportedly Hires for 3D-Stacked DRAM-on-Logic With a U.S. Customer; Targets On-Device AI 2026-07-24 Semiconductors editor News Please note that this article cites information from ZDNet, iNews24, and Newspim. SK hynix is reportedly stepping up development of 3D-stacked DRAM, a next-generation memory technology for on-device AI. According to ZDNet, the company has reported

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy beyond high-bandwidth memory and toward on-device AI applications.