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MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.The article requires paid subscription.Subscribe Now

MediaTek Intel CoWoS EMIB Advanced Packaging Semiconductor Industry Chip Design Foundry Manufacturing

When Encryption Meets Quantum

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eetimes.com 2026-05-14 Christophe Nicolas

Harvest now, decrypt later threats are accelerating migration from RSA and ECC toward post-quantum cryptographic architectures.

Quantum Computing Encryption Post-Quantum Cryptography Cybersecurity Semiconductor Design Digital Signatures Key Management Information Security

Chiplets Need A New Workflow

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semiengineering.com 2026-05-14 Ann Mutschler

Multi-die assemblies are facing full system-level challenges, but engineering teams nee...

Chiplets System-level design Advanced packaging Multi-physics simulation AI in chip design Reliability engineering Design flow 2.5D/3D architecture

Gates Add Functionality, But Wires Create Problems

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semiengineering.com 2026-05-14 Brian Bailey

Wires are treated as a lesser concern, but their neglect is becoming critical at advanc...

semiconductor manufacturing chip design interconnect delay wire routing transistor performance power delivery EDA tools advanced nodes

Nvidia CEO's foundation buys $108 million of AI computing from CoreWeave, donates it to researchers - Reuters

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www.reuters.com 2026-05-14 Reuters

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NVIDIA Sees Unusually High Options Volume (NASDAQ:NVDA) - MarketBeat

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www.marketbeat.com 2026-05-14 MarketBeat

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China's semiconductor godfather warns against 2nm fixation - digitimes

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www.digitimes.com 2026-05-14 digitimes

While the global semiconductor industry remains fixated on 3nm, 2nm, and the AI GPU arms race, SMIC founder and "China's semiconductor godfather" Zhang Rujing is pushing a sharply different message: the future of China's chip industry may depend less on...The article requires paid subscription.Subscribe Now

semiconductor industry chip manufacturing China semiconductor process node technology development industry policy chip design manufacturing process

Assessing Navitas Semiconductor (NVTS) Valuation After A Sharp Momentum-Fueled Share Price Rally - simplywall.st

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simplywall.st 2026-05-14 simplywall.st

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New Intel-supported memory design packs nine vertical layers - TechRadar

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www.techradar.com 2026-05-14 TechRadar

Copy linkFacebookXWhatsappRedditPinterestFlipboardThreadsEmailShare this article0Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterZAM stacks nine functional memory layers vertically inside every compact moduleEach ZAM memory layer reportedly contains exactly 1.125GB of DRAM capacityEstimated ZAM bandwidth figures now approach Nvidia HBM4 perf

Semiconductor Memory Technology Vertical Memory Stacking Intel Technology HBM4 Performance AI Accelerator Memory DRAM Storage TSV Technology 3D Memory Architecture

onsemi’s Q1 Earnings Call: Our Top 5 Analyst Questions - Yahoo Finance

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finance.yahoo.com 2026-05-14 Yahoo Finance

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IC‑Link by imec joins TSMC 3DFabric Alliance to expand advanced packaging capabilities - New Electronics

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www.newelectronics.co.uk 2026-05-14 New Electronics

The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac

Advanced Packaging 3D Integration Chip Design TSMC Semiconductor Ecosystem Chip Manufacturing System Integration Artificial Intelligence

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