MediaTek courts Intel as Google pushes for alternatives to CoWoS - digitimes

MediaTek's strategic move to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform represents a critical development in the semiconductor industry. This dec... Read original →

MediaTek’s pivot to Intel’s EMIB isn’t merely a response to Google’s CoWoS diversification push—it signals advanced packaging’s ascent from a backend process to a strategic lever. Technically, while EMIB lags CoWoS in interconnect density, its tight integration with Intel’s foundry ecosystem accelerates time-to-volume for heterogeneous AIoT chips. From a compliance standpoint, this mitigates geopolitical exposure tied to TSMC’s concentrated CoWoS capacity, especially as U.S. CHIPS Act incentives favor domestic advanced packaging. Competitively, Qualcomm and NVIDIA may soon adopt similar multi-source strategies, pressuring TSMC to either license IP or adjust pricing. Within 18 months, advanced packaging will shift from a performance enhancer to a mandatory supply chain criterion, forcing IDMs, OSATs, and fabless firms to redefine collaboration models.