Semiconductor News & Analysis Feed
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
Semiconductor Today
Navitas introduces isolated through-hole package for 1200–3300V SiC MOSFETs
Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has launched its new UHV‑TO‑247‑4‑ISO package, setting what is claimed to be a new benchmark for high‑performance discrete power devices.
Featuring over 12mm pin-to-pin creepage and greater than 6000V
2026-06-09
www.electronicsmedia.info
2026-06-09
Electronics Media
ROHM TSC3PAK SiC MOSFET Package Enables High-Efficiency Power Design for EVs
By Electronics Media -
June 9, 2026
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ROHM TSC3PAK SiC MOSFET Package – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product
2026-06-09
ackodrive.com
2026-06-09
ACKO Drive
SiC semiconductors are central to inverter systems in electric vehicles, where they regulate the flow of electricity between the battery and the motor.
Bosch has introduced its third-generation silicon carbide (SiC) semiconductors in India, targeting the expanding electric vehicle (EV) market with a focus on improving efficiency and reducing energy losses in powertrain systems. The company said
2026-06-09
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2026-06-09
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Bosch Brings Third-Generation SiC Chips to India’s EV Market
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Nikita Kumari
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Bosch
June 9, 2026
The new semiconductor platform promises higher efficiency, longer range, and more compact power electronics for next-generation electric vehicles.
Bosch has introduced its t
2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
Machine Maker
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2026-06-09
nebius.com
2026-06-09
Nebius
London, June 9, 2026 — Nebius, the AI cloud company, today announced the Physical AI Living Lab, a six-month program that equips British and European robotics startups with NVIDIA’s physical AI development tools and Nebius’s AI cloud infrastructure.
Physical AI depends on large-scale simulation, synthetic data, and accelerated compute that most early-stage robotics companies cannot assemble on th
2026-06-09
www.autocarpro.in
2026-06-09
Autocar Professional
Bosch Introduces Third-Generation SiC Chips for Electric Vehicle Applications in India
New silicon carbide semiconductor generation is designed to improve EV powertrain efficiency, support longer driving range and enable more compact power electronics systems.
By Eshisha Java 09 Jun 2026 105 Views
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Bosch has introduced its third-generation silicon carbide (SiC) semiconductors in India,
2026-06-09
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2026-06-09
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Infineon, Siemens Partner on SiC-Based Circuit Protection
By
Shubha Mitra
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Infineon
June 9, 2026
As AI data centres consume more power, could microsecond-scale circuit protection become essential? Infineon and Siemens are betting on silicon carbide technology.
German tech companies Infineon Technologies and Siemens have announced a collaboration to develop ad
2026-06-09
finance.yahoo.com
2026-06-09
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2026-06-09
www.eenewseurope.com
2026-06-09
eeNews Europe
Microchip has introduced 3.3 kV HV-D3 mSiC power modules aimed at solid-state transformer designs for AI data centres and other high-voltage power systems. The modules integrate 3.3 kV SiC MOSFETs and Schottky diodes in a standard 62 mm package.
The news is relevant for eeNews Europe readers because power delivery is becoming a limiting factor in AI infrastructure. It also points to how SiC devic
2026-06-09
www.electronicsmedia.info
2026-06-09
Electronics Media
Navitas Introduces Isolated Through-Hole Package for SiC MOSFETs, Enabling Direct-Cooled Thermal Management
By Electronics Media -
June 9, 2026
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Isolated Through-Hole Package for SiC MOSFETs – Navitas Semiconductor (Nasdaq: NVTS), an industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors,
2026-06-09
www.automotiveworld.com
2026-06-09
Automotive World
QDPAK's top-side thermal path allows the PCB and semiconductor domains to be managed separately, unlocking more power in less space
June 9, 2026
Nexperia has launched 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging for electric vehicle (EV) and industrial power conversion, enabling up to 3 kW more output power than conventional D2PAK-7 devices at comparable thermal limits. The portfolio
2026-06-09
www.automotiveworld.com
2026-06-09
Automotive World
A 44% switching loss reduction claim puts the Si829x at the centre of the EV drivetrain efficiency conversation for 2026 and beyond
June 9, 2026
Skyworks Solutions has unveiled the Si829x, an isolated gate driver for electric vehicle (EV) traction inverters, at PCIM 2026 in Nuremberg. Using ProVCD variable current drive technology, the Si829x cuts switching losses by up to 44% against voltage-mo
2026-06-09
www.automotiveworld.com
2026-06-09
Automotive World
Combining SiC chip expertise with module packaging could unlock EV drivetrain gains neither company achieves independently
June 9, 2026
Nexperia and Semikron Danfoss have signed a memorandum of understanding to explore a joint approach to silicon carbide (SiC)-based power modules for automotive traction inverter applications. The collaboration would combine Nexperia’s SiC semiconductor expertise
2026-06-09
digitimes.com
2026-06-09
Nvidia and Hyundai Motor Group have agreed to deepen their collaboration in artificial intelligence, robotics, and future mobility technologies as the two companies seek to accelerate the commercialization of physical AI and expand South Korea's role in next-generation AI infrastructure.
2026-06-09
digitimes.com
2026-06-09
Onsemi has introduced an online design tool to help engineers match SiC MOSFETs and gate drivers more quickly. The company said the platform could reduce early-stage trial-and-error in power electronics, with potential implications for AI data centers, electric vehicles, industrial systems, and electrification infrastructure worldwide.
2026-06-09
digitimes.com
2026-06-09
Computex 2026 closed last week with physical AI among its central themes, and robots emerging as one of the clearest ways to demonstrate it. Yet, unlike CES, where robot makers competed to showcase their hardware, Computex presented a different picture: AI computing platforms, edge inference, physical AI architectures, and the ecosystems behind robots took center stage.