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TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute...The article requires paid subscription.Subscribe Now

TSMC Artificial Intelligence Semiconductor Advanced Process AI Chips Cloud Computing Edge Computing Wafer Manufacturing

AI Chip Revolution Drives Advanced Packaging Market Toward $116 Billion by 2035 - TimesTech

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timestech.in 2026-05-14 TimesTech

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LPKF Laser: Restructuring Meets Rally as All Eyes Turn to Advanced Packaging - AD HOC NEWS

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www.ad-hoc-news.de 2026-05-14 AD HOC NEWS

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Samsung reportedly speeds up 3D NAND, packaging, and substrate plans - digitimes

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www.digitimes.com 2026-05-14 digitimes

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now

Samsung Electronics 3D NAND Advanced Packaging Semiconductor Manufacturing Flash Memory Compound Semiconductors Substrate Technology DRAM Design

IC‑Link by imec joins TSMC 3DFabric Alliance to expand advanced packaging capabilities - New Electronics

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www.newelectronics.co.uk 2026-05-14 New Electronics

The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac

Advanced Packaging 3D Integration Chip Design TSMC Semiconductor Ecosystem Chip Manufacturing System Integration Artificial Intelligence

IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation - EEJournal

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www.eejournal.com 2026-05-13 EEJournal

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Intel Lands a Preliminary Apple Chip Deal and an SK Hynix Packaging Partnership — Is INTC Still a Buy at $124? - TradingKey

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www.tradingkey.com 2026-05-13 TradingKey

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Why Kulicke and Soffa (KLIC) Is Benefiting From the Advanced Packaging Recovery - Insider Monkey

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www.insidermonkey.com 2026-05-13 Insider Monkey