Semiconductor News & Analysis Feed
28 articles
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-11
www.klsescreener.com
2026-06-11
KLSE Screener
This article first appeared in The Edge Malaysia Weekly on June 1, 2026 - June 7, 2026
FOR years, outsourced semiconductor assembly and test (OSAT) providers were viewed as the lower-margin, labour-intensive end of the semiconductor value chain — far removed from the prestige of chip design and wafer fabrication.
As artificial intelligence (AI), electric vehicles, data centres and high-performan
2026-06-08
finance.yahoo.com
2026-06-08
Yahoo Finance
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2026-06-08
www.koreaherald.com
2026-06-08
The Korea Herald
Doosan Group Chairman Park Jeong-won (right) presents Doosan Ildu, a symbolic sculpture representing the company’s philosophy, to Nvidia CEO Jensen Huang, celebrating Huang’s visit to Jamsil Baseball Stadium in Seoul on Sunday. (Doosan Group)
Doosan Group said Monday it would deepen ties with US chip giant Nvidia in physical AI-driven robotics and AI factories, expanding their partnership beyond
2026-06-08
siliconangle.com
2026-06-08
SiliconANGLE
Artificial intelligence chipmaker Nvidia Corp. today announced a slate of new partnerships with some of South Korea’s biggest technology, including the memory chip supplier SK hynix Inc., internet giant Naver Corp. and the multinational conglomerate Doosan Group.
The deals came during a high-profile trip by Nvidia Chief Executive Jensen Huang to the country. He arrived on Friday, and has spent th
2026-06-08
www.tradingview.com
2026-06-08
TradingView
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2026-06-08
digitimes.com
2026-06-08
Nvidia and Doosan Group are widening their collaboration to develop physical AI, robotics, and AI factory infrastructure that could shape industrial automation worldwide. The effort spans robotics, heavy equipment, power systems, and advanced materials, highlighting how global AI growth is increasingly tied to manufacturing, energy, and data center supply chains.
2026-06-08
finance.yahoo.com
2026-06-08
Yahoo Finance
__fail__
2026-06-08
blogs.nvidia.com
2026-06-08
NVIDIA Blog
NVIDIA and Doosan Group Collaborate to Advance Physical AI and AI Factory Infrastructure
Companies to explore robotics, AI factory power solutions and advanced electronics materials for next-generation data center systems.
June 7, 2026 by Madison Huang
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NVIDIA and Doosan Group are expanding their collaboration to advance new opportunities across physical AI, robotics and AI factory infra
2026-06-07
digitimes.com
2026-06-07
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.
2026-06-04
news.google.com
2026-06-04
WSTM
2026-06-04
news.google.com
2026-06-04
Let's Data Science
2026-06-02
eetimes.com
2026-06-02
Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance and energy-efficiency gains.
2026-06-01
www.tomshardware.com
2026-06-01
Tom's Hardware
PC Components CPUs
Nvidia lays out RTX Spark roadmap for laptops and desktop PCs at Computex 2026 — three generations outlined, Rubin with LPDDR6 memory, followed by Rosa Feynman
News
By Jeffrey Kampman published 1 June 2026
Nvidia is fully committed to transforming Windows on Arm into an agentic AI platform
(Image credit: Future)
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2026-05-28
digitimes.com
2026-05-28
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as demand grows for infrastructure optimized for AI reasoning and high-volume inference workloads.
2026-05-27
wccftech.com
2026-05-27
Wccftech
FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory.
FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM
2026-05-27
www.theregister.com
2026-05-27
The Register
AI+ML
Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire
Third-gen chips to use Broadzilla's advanced packaging, networking tech
Tobias Mann
Systems editor
0
Published Wed 27 May 2026 // 13:00 UTC
Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech.
After years quietly serving as the connective tissue behind many modern
2026-05-27
letsdatascience.com
2026-05-27
Let's Data Science
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broadcom
furiosaai
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Broadcom Adds FuriosaAI for Custom AI Accelerators
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May 27, 2026
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Broadcom has added South Korea's FuriosaAI to its roster of partners building AI accelerators on Broadcom's packaging and networking technology, The Register reports
2026-05-27
digitimes.com
2026-05-27
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.