JCET opens 3D packaging plant to target AI power modules, CPO demand

JCET's new 3D packaging facility in Jiangyin isn't mere capacity scaling—it's a strategic bet on the architectural shift in AI compute. This move pressures upstream material suppliers to accelerate low-loss interposers and high-thermal-conductivity substrates, while nudging GPU clients to diversify beyond TSMC’s CoWoS. With U.S. export controls tightening on advanced packaging tools, reliance on American equipment could inflate compliance costs and disrupt delivery timelines. Competitors like ASE and Amkor may double down on CPO co-development with NVIDIA, while OSATs in Taiwan, China might expedite Southeast Asian expansions to hedge geopolitical exposure. Over the next 18 months, as AI server power density surges past 1kW, heterogeneous integration of GaN/SiC power modules will define competitive advantage—JCET is effectively vying to shape the physical layer of next-gen data centers.