Semiconductor News & Analysis Feed

SK Hynix Cheongju Campus P&T7 (Artist’s rendering). Credit: SK Hynix SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to... Some subscribers prefer to save their log-in inform

SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.

Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.

Phison Electronics CEO Khein-seng Pua said the NAND flash market is facing a supply crunch with "no end in sight," as AI continues to crowd out memory capacity and push storage demand higher.

Why Micron Technology’s (MU) New York Fab Plan Matters for U.S. AI Memory Capacity Habib Ur Rehman Tue, 23 June 2026 at 9:09 am GMT-7 1 min read MU -13.18% Micron Technology, Inc. (NASDAQ:MU) is one of the fastest-growing high-bandwidth memory stocks to buy. The company advanced its U.S. memory capacity plan on June 10, 2026, when it selected Bechtel as the engineering, procurement, and construct

Why Micron Technology’s (MU) New York Fab Plan Matters for U.S. AI Memory Capacity Habib Ur Rehman Tue, June 23, 2026 at 9:09 AM PDT 1 min read MU -13.18% Trade MU on Coinbase Trading disclosure Micron Technology, Inc. (NASDAQ:MU) is one of the fastest-growing high-bandwidth memory stocks to buy. The company advanced its U.S. memory capacity plan on June 10, 2026, when it selected Bechtel as the

Korean chip manufacturer SK hynix had been planning to double its memory production capacity by 2030 and 2031 from current levels, even before a request from NVIDIA CEO Jensen Huang, suggests a report from the Korean media. The NVIDIA CEO wrote "please make more" on a hynix wafer at the Computex conference in Taiwan, and supply chain sources suggest that the memory manufacturer plans to expand its

Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo

Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints, chip-scaling limits, and growing demand for faster equipment delivery.

__fail__