Semiconductor News & Analysis Feed
23105 articles
2026-06-11
digitimes.com
2026-06-11
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of "software-hardware integration."
2026-06-11
digitimes.com
2026-06-11
Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for the cloud AI connectivity chip supplier as demand grows for scale-up infrastructure in AI clusters.
2026-06-11
digitimes.com
2026-06-11
Gudeng chairman and CEO Bill Chiu said global demand for AI is driving a wave of 2nm and 3nm advanced-node capacity expansion, but the biggest constraint for chipmakers is not building fabs — it is securing extreme ultraviolet lithography systems.
2026-06-11
digitimes.com
2026-06-11
TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members seek to expand their role in global chip supply chains.
2026-06-11
digitimes.com
2026-06-11
While marketing initiatives promote an ultra-fast transition to wide-bandgap (WBG) semiconductors, fully automated smart factories, and an all-electric automotive future, the sentiment across the PCIM Europe 2026 exhibition floor is more pragmatic. The industry has reached a transitional maturity wall where the realities of material physics, fragmented design silos, and macroeconomic supply shocks
2026-06-11
digitimes.com
2026-06-11
Memory supply remains tight, and higher prices have made end markets cautious. Despite that, Apacer Technology CEO Chia-Kun Chang said that foundry shifts by the three major makers are irreversible, meaning DRAM and flash will stay in short supply, and the memory industry will continue to profit at least throughout the first half of 2027.
2026-06-11
digitimes.com
2026-06-11
Andy Hock, chief strategy officer at Cerebras Systems, walked onto the Main Stage at SuperAI Singapore 2026 on Wednesday carrying the company's Wafer Scale Engine — the physical chip itself — and held it up for an audience of 10,000 before placing it next to a slide showing it to scale against Nvidia's latest B200 platform. The size difference was stark.
2026-06-11
digitimes.com
2026-06-11
AI servers and high-voltage electric vehicles (EVs) are tightening the global supply of high-end multilayer ceramic capacitors (MLCCs), prompting some Taiwan supply chain players to qualify Chinese alternatives such as Chaozhou Three-Circle as lead times lengthen.
2026-06-11
digitimes.com
2026-06-11
Recent market speculation suggests that Nvidia's ambitious transition to a native 800-volt direct-current (800VDC) architecture for AI data centers may be delayed by up to a year, pushing large-scale production and deployment beyond 2028. The reports also claim that major cloud service providers (CSPs) could postpone adoption of the technology.
2026-06-11
digitimes.com
2026-06-11
MicroIP has opened a nearly 300-ping southern R&D center at Kaohsiung's PIER F, with plans to expand smart manufacturing and smart transportation applications. The move signals a deeper push to link AI development with local logistics, industry, and public infrastructure.
2026-06-11
digitimes.com
2026-06-11
Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node chips, while the company reiterates compliance with local laws and highlights ongoing legal uncertainty in its quarterly filing.
2026-06-11
digitimes.com
2026-06-11
Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future of AI networking, could face further delays as manufacturing yields remain inconsistent.
2026-06-11
digitimes.com
2026-06-11
Montage Technology has begun sampling its sixth-generation DDR5 registering clock driver chip (RCD06) to customers, marking a step forward in the performance upgrade of next-generation server memory platforms.
2026-06-11
digitimes.com
2026-06-11
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure aimed at activating assets and focusing on its core business. It is also intended to improve the group's capital allocation efficiency, optimize its balance sheet, and boost earnings per share (EPS).
2026-06-11
digitimes.com
2026-06-11
Taiwan's export growth has accelerated to its strongest pace in nearly 16 years on the back of AI and higher prices for electronic components, drawing large amounts of capital into the stock market and other asset markets. Central bank governor Chin-Long Yang said on June 10 that Taiwan remains far from systemic risk despite concerns over surging market activity.
2026-06-11
digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
2026-06-11
semiengineering.com
2026-06-11
Brian Bailey
It depends on what those models are used, which also can have a big impact on the cost.
2026-06-11
eetimes.com
2026-06-11
Pablo Valerio
Gartner's VP analyst David Gonzalez shares strategies for profitability and technology in supply chain management.
2026-06-11
digitimes.com
2026-06-11
Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment. The move highlights how AI demand is influencing chipmakers, equipment suppliers, and global customers, with implications for production capacity, regional innovation hubs, and technology markets worldwide.
2026-06-11
digitimes.com
2026-06-11
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating c