Gudeng flags EUV supply constraints as advanced-chip expansion accelerates

Gudeng’s warning exposes a critical bottleneck: while AI-driven demand accelerates 2nm/3nm capacity build-outs, the real constraint lies in securing EUV scanners—not fabs. ASML’s limited output, constrained by Zeiss optics and export controls, creates a supply-demand chasm. Technically, this forces TSMC, Samsung, and Intel toward costly multi-patterning or rushed High-NA transitions, inflating defect rates and delaying yield ramps. Geopolitically, U.S. export restrictions on EUV tools inject delivery uncertainty for expansions in Taiwan, China and South Korea, compelling foundries to pre-book tools and over-engineer supply buffers. Samsung may pivot faster toward alternative lithography R&D with IMEC, while SMIC remains locked out of the advanced race. Over the next 12–24 months, EUV access will define who truly scales—paper capacity won’t translate to real output without machines on the floor.