Semiconductor News & Analysis Feed
30 articles
2026-06-12
digitimes.com
2026-06-12
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales, pressuring its May results and revenues for the first five months of the year. The company disclosed May revenue of NT$63.87 million (US$2 million), down 29.37% month-over-month, and cumulative revenue for the first
2026-06-12
digitimes.com
2026-06-12
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest accumulated growth concentrated in AI-linked logic, testing, substrate, and copper-clad laminate suppliers.
2026-06-10
eetimes.com
2026-06-10
Efinix’ exchangeable logic-and-routing technology aims to cut power and die area while enabling memory integration and greater flexibility for AI edge designs.
2026-06-09
digitimes.com
2026-06-09
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
2026-06-04
iconnect007.com
2026-06-04
I-Connect007
Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0
June 4, 2026 | Global Electronics Association
Estimated reading time: 2 minutes
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. This proposal marks
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
www.ad-hoc-news.de
2026-06-03
AD HOC NEWS
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2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
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2026-05-28
www.digitimes.com
2026-05-28
digitimes
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the
2026-05-28
digitimes.com
2026-05-28
Peking University researchers have unveiled a prototype electronic design automation (EDA) tool built for "true-3D" chip design, offering a potential missing link for Huawei's LogicFolding architecture and its broader Tau (τ) Scaling Law roadmap.
2026-05-27
www.barrons.com
2026-05-27
Barron's
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2026-05-26
qz.com
2026-05-26
qz.com
EMERGING TECHNOLOGIES
Huawei is unveiling a new 3D chip design it says can close the gap with global leaders
The Chinese tech giant says its new stacked-chip architecture can deliver transistor density equivalent to 1.4nm processes by 2031, without access to advanced lithography tools
By
Cris Tolomia
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Published 16 minutes ago
2026-05-26
www.actuia.com
2026-05-26
Actu IA
Artificial intelligence/Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031
Table of contents
A Temporal Scaling Law to Succeed Moore
LogicFolding: 3D Against EUV, and Its Shades
A 3D Architecture That Isn't Uniquely Huawei's
He Tingbo, the Tutelary Figure of HiSilicon
On May 25, 2026, He Tingbo, president of Huawei's semiconductor department and board member
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo