Semiconductor News & Analysis Feed
20427 articles
2026-06-18
digitimes.com
2026-06-18
Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.
2026-06-18
semiengineering.com
2026-06-18
Katherine Derbyshire
Why new designs and process flows could help overcome manufacturing challenges.
2026-06-18
semiengineering.com
2026-06-18
Bryon Moyer
Hybrid bonding permits unprecedented connection density.
2026-06-18
digitimes.com
2026-06-18
Demand in the passive components market is recovering significantly, lifting operating momentum at Taiwan's two leading suppliers, Yageo and Walsin Technology. Average book-to-bill ratios at both companies have risen above 1.3, placing industry conditions near their highest levels in recent years and reinforcing expectations for sequential growth through 2026.
2026-06-18
digitimes.com
2026-06-18
Backlight module maker Darwin held its shareholders' meeting on June 17, 2026, and said it remains cautiously optimistic about 2026 revenue as its new businesses continue to gain traction. The company cited fresh commercial display orders in the US market and said organ-chip partner Anivance AI is also listed on an "Nvidia backdrop," adding momentum to its medical technology push.
2026-06-18
digitimes.com
2026-06-18
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6 chip is expected to set a new record for maximum usable computing power per wafer.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
2026-06-18
digitimes.com
2026-06-18
In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become "unsustainable."
2026-06-18
digitimes.com
2026-06-18
Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.
2026-06-18
eetimes.com
2026-06-18
Pablo Valerio
Experts at RISC-V Summit Europe outlined how open architectures are transforming computing across the space economy.
2026-06-18
digitimes.com
2026-06-18
Taiwan's electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas in
2026-06-18
digitimes.com
2026-06-18
A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.
2026-06-18
stocksdownunder.com
2026-06-18
Stocks Down Under
Tape-out clears the path to validation data, with compute-in-memory and TSMC-sourced wafers framing the commercial pitch
dorsaVi (ASX:DVL) has reached the moment its RRAM equity story has been pointing toward for the better part of two years. The company has finalised the full design package for its first integrated RRAM-CMOS validation chip, developed alongside NTU Singapore and ITRI Taiwan, and
2026-06-18
letsdatascience.com
2026-06-18
Let's Data Science
INFRASTRUCTURE
hbm4e
sk hynix
memory
ai infrastructure
SK hynix Ships 12-Layer HBM4E Samples to Customers
5 sources
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June 17, 2026
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Photo: manilatimes.net · rights & takedowns
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SK hynix announced it has shipped samples of its 12-layer HBM4E high-bandwidth memory to major customers, according to a PR Newswire release carried by Manila Times, Morningstar and ot
2026-06-18
www.digitimes.com
2026-06-18
digitimes
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry...
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2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
Nvidia Just Raised $25 Billion in Debt. Here's What That Really Tells Investors
Daniel Sparks, The Motley Fool
Wed, June 17, 2026 at 4:52 PM PDT 4 min read
NVDA
-1.33%
Trade NVIDIA on Coinbase
Trading disclosure
On June 15, Nvidia (NASDAQ: NVDA) priced a $25 billion sale of senior notes -- its biggest bond offering to date and its first trip to the debt market since 2021. The deal spans seven tra
2026-06-18
news.stocktradersdaily.com
2026-06-18
Stock Traders Daily
STOCK ANALYSIS
How Invesco Phlx Semiconductor Etf (SOXQ) Affects Rotational Strategy Timing
June 17, 2026, 23:50 pm ET
BY Quantitative Research Desk - Contributor
Editor: Thomas H. Kee Jr. (Follow on LinkedIn)
Key findings for Invesco Phlx Semiconductor Etf (NASDAQ: SOXQ)
Strong Sentiment Across All Horizons Supports Overweight Bias
No clear price positioning signal identified.
No resistance level
2026-06-18
www.reuters.com
2026-06-18
Reuters
__fail__
2026-06-18
www.tradingview.com
2026-06-18
TradingView
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Reuters
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Nvidia supplier SK Hynix ships samples of next-generation chips to major customers
Nvidia supplier SK Hynix ships samples of next-generation chips to major customers
RefinitivLess than 1 min read
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2026-06-18
www.prnewswire.com
2026-06-18
PR Newswire
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
NEWS PROVIDED BY
SK hynix Inc.
Jun 17, 2026, 19:35 ET
SHARE THIS ARTICLE
- Delivers 12-high HBM4E samples to major customers
- Achieves a maximum speed of 16Gbps per pin with improvements in both performance and efficiency
- Utilizes Advanced MR-MUF, reducing heat resistance by 17% while improving stability
- SK hynix st