Semiconductor News & Analysis Feed
107 articles
2026-07-07
news.google.com
2026-07-07
Shetland News
2026-07-06
news.google.com
2026-07-06
Innovation News Network
2026-07-03
eetimes.com
2026-07-03
EE Times examines the companies, institutes, and policy initiatives positioning Spain within Europe’s next wave of semiconductor innovation.
2026-07-02
www.thelec.net
2026-07-02
thelec.net
2026-07-02
semiengineering.com
2026-07-02
Liz Allan
Ongoing innovations are enabling humanoids to see and move more like humans, while smel...
2026-07-02
semiengineering.com
2026-07-02
Liz Allan
The EV revolution relies on battery innovation, while AI data centers need a range of n...
2026-07-02
www.marketscreener.com
2026-07-02
marketscreener.com
2026-07-01
investingnews.com
2026-07-01
Investing News Network
2026-07-01
www.euractiv.com
2026-07-01
Euractiv
2026-07-01
sg.finance.yahoo.com
2026-07-01
Yahoo Finance Singapore
2026-07-01
www.bisinfotech.com
2026-07-01
Bisinfotech
2026-06-30
datacenters.economictimes.indiatimes.com
2026-06-30
Indiatimes
EVENT
National Data Centers Summit 2026
ET DCNXT 2026–with the theme ‘Data Centres for an AI-first World’--is a one-day flagship event that will bring together the builders of infrastructure, enablers of AI, consumers of AI, capital allocators, and policy architects to answer one central question: Can India become the world’s AI infrastructure backbone through its data centres?
Wed, 26 Aug 2026
Hy
2026-06-29
logisticsbusiness.com
2026-06-29
Logistics Business
More than 160 attendees representing 87 companies across 30 countries gathered at the headquarters of CMC Packaging Automation for CID26 – CMC Innovation Day 2026, the company’s annual event dedicated to innovation in fulfilment automation, systems integration and right-sized packaging.
Built around the theme ‘Ecosystem’, CID26 brought together customers, technology partners, policymakers and ind
2026-06-29
www.snsinsider.com
2026-06-29
SNS Insider
The Power Module Packaging market is showing significant growth due to an increase in the usage of electric vehicles, implementation of renewable energy, AI-based data centers, and industrial electrification. Power module packaging technology plays an essential part in improving thermal management, reliability, energy density, and energy efficiency of today's power electronics systems. Adoption of
2026-06-26
www.wsj.com
2026-06-26
WSJ
__fail__
2026-06-24
itif.org
2026-06-24
Information Technology and Innovation Foundation (ITIF)
The Trump administration has imposed tariffs on semiconductor imports on national security grounds under Section 232 of the Trade Expansion Act. These tariffs would raise ICT prices and thereby lower ICT consumption and capital stocks, which would reduce economic growth and lower Americans’ living standards.
2026-06-24
digitimes.com
2026-06-24
At VivaTech 2026 in Paris last week, Philippe Keryer, Chief Strategy and Innovation Officer at Thales, identified Europe's core quantum challenge in a single observation: "The problem is not really how we invent, it's really how we scale."
2026-06-24
pulse2.com
2026-06-24
Pulse 2.0
Qnity Electronics announced the launch of its Advanced Packaging Innovation Hub, a new online platform showcasing the company’s material and technology solutions for advanced packaging.
The launch highlights advanced packaging as a strategic growth driver and innovation priority for Qnity. The company said its solutions are designed to support next-generation artificial intelligence, high-perform
2026-06-23
www.storagenewsletter.com
2026-06-23
StorageNewsletter
SK hynix Receives 2026 IEEE Corporate Innovation Award for Driving AI Computing Expansion with HBM
Recognition highlights the company's achievements in driving expansion of AI computing through HBM innovation and application
This is a Press Release edited by StorageNewsletter.com on June 23, 2026 at 2:00 pm
SK hynix Inc. announced that it received the Corporate Innovation Award at the ‘2026 IEEE
2026-06-23
www.snsinsider.com
2026-06-23
SNS Insider
The 3D IC market is witnessing tremendous growth because the semiconductor industry is adopting advanced packaging technologies in order to address the escalating needs for better performance, bandwidth, and energy efficiency required for artificial intelligence, HPC, 5G networking, automotive electronics, and consumer devices. Traditional planar chip designs have started facing physical and econo