Semiconductor News & Analysis Feed
198 articles
2026-07-02
thediplomat.com
2026-07-02
The Diplomat – Asia-Pacific
2026-07-01
semiengineering.com
2026-07-01
Semiconductor Engineering
In next-generation silicon, AI can interpret system behavior at scale, but only if observability is designed into the fabric as a first-class architectural capability.
Experts At The Table: In-silicon observability—also known as on-die or on-chip visibility—is becoming increasingly important for managing the performance, reliability, and security of today’s high-performance systems. Semiconductor
2026-07-01
digitimes.com
2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-07-01
semiengineering.com
2026-07-01
Ann Mutschler
In next-generation silicon, AI can interpret system behavior at scale, but only if obse...
2026-06-30
www.institutmontaigne.org
2026-06-30
Institut Montaigne
2026-06-29
siliconcanals.com
2026-06-29
Silicon Canals
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2026-06-29
www.allaboutcircuits.com
2026-06-29
All About Circuits
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2026-06-29
www.digitaltoday.co.kr
2026-06-29
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Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
AI Summary
Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memo
2026-06-28
vietnamnet.vn
2026-06-28
Báo VietNamNet
As Vietnam strengthens its policy framework, legal foundation, national strategy and science and technology programs for the semiconductor industry, one question remains: how can the country move further up the global semiconductor value chain?
From a practical perspective, turning chip designs into fully manufactured integrated circuits still faces significant obstacles.
According to the Minist
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-26
digitimes.com
2026-06-26
SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by February 2027, ahead of rival capacity expansion timelines. The site's first fabrication facility will break from conventional flat-floor layouts, stacking production floors three levels high in a pioneering triple-deck fab design.
2026-06-26
digitimes.com
2026-06-26
Alibaba Group's semiconductor design arm T-Head has more than tripled its registered capital, underscoring the Chinese technology giant's growing focus on artificial intelligence infrastructure and domestic chip development.
2026-06-25
semiengineering.com
2026-06-25
Semiconductor Engineering
In Part 1, we looked at the innovations underpinning the Cerebras WSE-3 and why its most significant breakthrough is the elimination of data movement overhead at the architectural level, not better yield management or thermal engineering. Cerebras’ on-wafer fabric is a viable answer to the question being asked by the entire industry: how do you move data fast enough that compute stops waiting?
Th
2026-06-25
www.indexbox.io
2026-06-25
IndexBox
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2026-06-25
www.qualcomm.com
2026-06-25
Qualcomm
Qualcomm Incorporated (NASDAQ: QCOM), a connected computing leader at the center of the AI era, today outlined the acceleration of its diversification strategy and unveiled its comprehensive strategy for the data center, marking its next phase of growth across every tier of the compute continuum, at its 2026 Investor Day.
“We are defining Qualcomm’s next chapter as we accelerate our edge diversi
2026-06-25
investor.qualcomm.com
2026-06-25
Qualcomm
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– Establishes Strong Foundation for Long-Term Growth in the Agentic Era –
– Expands Beyond Silicon to Deliver a Range of Full-Stack AI Platforms, from Edge to Cloud –
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2026-06-24
www.thestreet.com
2026-06-24
thestreet.com
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2026-06-24
www.thediplomat.ro
2026-06-24
The Diplomat Bucharest
HomeNewsGunter Krasser, Infineon Technologies: “Building technology hubs requires talent, collaboration and funding”
Gunter Krasser, Infineon Technologies: “Building technology hubs requires talent, collaboration and funding”
NEWS
TOP STORIES
TECHNOLOGY
PUBLISHED ON
JUNE 24, 2026
BY
PETRE BARAC
Strong university partnerships, thriving technology ecosystems and targeted funding mechanisms are es
2026-06-24
pandaily.com
2026-06-24
Pandaily
AI
Embodied AI Chip Market Heats Up as Multiple Players Race for Dominance
Published:
June 24, 2026
Reading Time:
3 min read
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Embodied AI Chip Market Heats Up as Multiple Players Race for Dominance
Embodied AI Chip Market Heats Up as Multiple Players Race for Dominance
The embodied AI chip market is experiencing an unprecedented surge of com
2026-06-23
tomshardware.com
2026-06-23
Jowi Morales
Adding Nvidia and dual-boot support will certainly make SteamOS a much more appealing solution for gamers who don’t want multiple hardware or only have a single device for both work and play.