CHIPDIPLO Brussels Conference: "Semiconductors Under Geopolitical Stress: From Global Shocks to the European Chips Act 2.0" - Institut Montaigne

The conference 'Semiconductors Under Geopolitical Stress: From Global Shocks to the European Chips Act 2.0', scheduled for July 9, 2026 in Brussels, brings together policymakers, industry leaders, and... Read original →

Geopolitical friction is fracturing the semiconductor tech stack at its core. U.S. export controls now impede EDA tools and advanced packaging equipment, compelling Europe to fast-track indigenous IP ecosystems and closed-loop capabilities for mature nodes (28nm+). Soaring compliance costs will squeeze out smaller design houses, leaving only giants able to absorb multi-jurisdictional certifications and buffer inventories. TSMC and Samsung may accelerate fab expansions in Germany or Hungary to hedge policy risks, while SMIC bolsters supply chain redundancy beyond Taiwan, China. Within 18 months, the EU’s Chips Act 2.0 will likely enforce harmonized subsidies across member states and forge a 'trusted supply chain alliance' with Japan and India—effectively cementing technological blocs. Efficiency is no longer the priority; control over equipment, materials, and talent flows dictates who shapes the next semiconductor order.