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This article examines the increasingly critical on-chip observability technologies in modern chip design, particularly in the context of artificial intelligence and multi-die system architectures. As chip complexity continues to rise, traditional testing and debugging methods can no longer meet mode

As artificial intelligence becomes increasingly integrated into chip design, observability emerges as a critical requirement. In next-generation silicon, AI can interpret system behavior at scale, but only if observability is embedded as a first-class architectural capability. Industry experts agree

As the AI era unfolds, chip design is increasingly adopting modular architectures such as chiplets. However, a critical missing layer—observability—has not been adequately addressed. In chiplet-based systems, observability must be designed as a fabric-aligned, cross-die telemetry plane to enable arc

As modern high-performance systems demand greater performance, reliability, and security, in-silicon observability has become a critical aspect of semiconductor design. Experts from companies such as Arteris, Baya Systems, Cadence, Keysight EDA, Vinci, Synopsys, Siemens EDA, and Movellus discussed t