Semiconductor News & Analysis Feed
735 articles
2026-06-29
www.techtimes.com
2026-06-29
Tech Times
By Adrian Parham
Published: Jun 29 2026, 5:08 AM EDT
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LENOVO.COM
Lenovo's AI server pipeline has swelled to $21 billion in undelivered committed orders, a figure that crystallized at MWC Shanghai 2026 as the defining number of China's AI infrastructure race — and a concrete measure of how far t
2026-06-29
www.digitimes.com
2026-06-29
digitimes
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers also expect Samsung to expand 1c DRAM production for HBM4 while raising...
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2026-06-29
www.moomoo.com
2026-06-29
Moomoo
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2026-06-29
biz.chosun.com
2026-06-29
Chosunbiz
By
Lee Jong-hyun
Published 2026.06.29. 14:54
Updated 2026.06.29. 16:12
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Japan's Top Doctors: Memory Loss? Just Stop Eating 3 Foods
Health Living Report
Japan's Top Do
2026-06-29
biz.chosun.com
2026-06-29
Chosunbiz
By
Lee Jong-hyun,
Song Bok-gyu
Published 2026.06.29. 14:53
Updated 2026.06.29. 16:12
Samsung Electronics Chairman Lee Jae-yong said on the 29th that Gwangju is being planned as a candidate site for a semiconductor production complex.
Lee Jae-yong, chairman of Samsung Electronics, announces an investment plan at the National Briefing on the Three Mega Projects for Korea's Great Leap held at the
2026-06-29
www.digitimes.com
2026-06-29
digitimes
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move is seen as an effort to reset its medium- to long-term plans in a rapidly...
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2026-06-29
www.digitaltoday.co.kr
2026-06-29
디지털투데이
Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
AI Summary
Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memo
2026-06-29
biz.chosun.com
2026-06-29
Chosunbiz
By
Jeong Du-yong
Published 2026.06.29. 10:01
The lineup of 3D chip manufacturing equipment for AI semiconductors unveiled by Applied Materials./Courtesy of Applied Materials
Semiconductor equipment corporations Applied Materials unveiled a lineup of 3D chip manufacturing tools for artificial intelligence (AI) semiconductors. The focus is on expanding planarization, deposition and metrology tools
2026-06-29
digitimes.com
2026-06-29
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers also expect Samsung to expand 1c DRAM production for HBM4 while raising the latter's prices in 2027 to boost both market share and profitability.
2026-06-29
digitimes.com
2026-06-29
South Korean media report that SK Hynix has created a new memory strategy organization, a "Growth Strategy Department," to map out next-generation semiconductor strategy. The move is seen as an effort to reset its medium- to long-term plans in a rapidly shifting memory market and preserve its leadership position.
2026-06-29
www.digitimes.com
2026-06-29
digitimes
Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor Manufacturing Corp. (PSMC) and AP Memory appearing alongside Intel and SoftBank subsidiary SAIMEMORY in a nine-layer 3D...
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2026-06-28
www.ad-hoc-news.de
2026-06-28
Ad-hoc-news.de
KLA Corporation, US4824801009
KLA Corporation with strong HBM demand, shares supported by analyst optimism
28.06.2026 - 14:37:20 | ad-hoc-news.de
KLA Corporation benefits from robust demand in high bandwidth memory and advanced packaging, while analysts maintain a constructive view on the Nasdaq-100 listed semiconductor equipment group.
KLA Corporation, US4824801009
By Anna Wagner, Analysts & C
2026-06-28
www.fxleaders.com
2026-06-28
FXLeaders
Micron Technology (MU) is experiencing an historic run, driven by massive demand for its high-bandwidth memory (HBM) chips in AI infrastructure.
The primary reason for the aggressive rally is extreme optimism ahead of Micron’s Fiscal Q3 Earnings Release on Wednesday, June 24, 2026, after the market closes. Consensus estimates project a massive jump to an EPS of around $19.72 on revenue of $34.52
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-27
simplywall.st
2026-06-27
simplywall.st
United States/Semiconductors/NasdaqGS:PLAB
Will SK Hynix’s HBM Re‑Prioritization Shift Change Photronics’ (PLAB) AI Supply Chain Narrative?
June 27, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Recently, reports that South Korea's SK Hynix is slowing its high‑bandwidth memory expansion to prioritize higher‑margin conventional DRAM unsettled sentiment across the AI‑chip supply chain, affecting r
2026-06-26
biz.chosun.com
2026-06-26
Chosunbiz
By
Jeong Du-yong
Published 2026.06.26. 18:53
Samsung Electronics' Seocho office building in Seocho-gu, Seoul./Courtesy of News1
Samsung Electronics plans to significantly boost the energy efficiency of high bandwidth memory (HBM) and server solid-state drives (SSD) to meet rising power demand at artificial intelligence (AI) data centers. The overall employee turnover rate last year fell to singl
2026-06-26
www.digitimes.com
2026-06-26
digitimes
Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls High Bandwidth Compute, or HBC, as a key weapon in its challenge to Nvidia, AMD and AI chip startups.
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2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
www.fxleaders.com
2026-06-26
FXLeaders
Micron Technology (MU) is experiencing an historic run, driven by massive demand for its high-bandwidth memory (HBM) chips in AI infrastructure.
The primary reason for the aggressive rally is extreme optimism ahead of Micron’s Fiscal Q3 Earnings Release on Wednesday, June 24, 2026, after the market closes. Consensus estimates project a massive jump to an EPS of around $19.72 on revenue of $34.52