Hanmi Semiconductor Targets AI Packaging Market After HBM Dominance - Seoul Economic Daily

Hanmi Semiconductor is targeting the AI packaging market following its dominance in HBM technology. As AI computing demands surge, the semiconductor industry is experiencing increased demand for high-... Read original →

Hanmi Semiconductor’s pivot from HBM packaging leadership to broader AI advanced packaging leverages its 3D stacking and TSV expertise, triggering upstream demand for low-k dielectrics and thermal interface materials while pressuring GPU makers to diversify beyond TSMC’s CoWoS. Amid U.S.-EU reshoring mandates, overreliance on Taiwan, China-based CoWoS capacity exposes Korean firms to supply chain fragility—prompting vertical integration despite export controls and talent shortages. Competing against ASE, Amkor, and other Taiwan, China OSATs requires Hanmi to weaponize its HBM yield data to co-develop new integration standards with NVIDIA and AMD. Within 18 months, AI packaging will shift from pure performance to a triad of cost, energy efficiency, and lead time; firms mastering HBM-to-AI packaging migration will dictate next-gen chiplet interconnect protocols.