Semiconductor News & Analysis Feed

Two separate announcements on May 29 landed in the same corner of the semiconductor industry, and their combined implications for South Korea's chipmakers are more significant than either story suggests on its own. Nikon's new chief executive told Nikkei Asia that the Japanese optics maker is in advanced talks with major chipmakers in the United States and Asia to supply lower-priced deep-ultravio

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they v

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.