Glass substrates, TGV set to reshape 2027 advanced packaging race

The expanding die sizes of AI chips are propelling advanced packaging toward higher technological tiers, with glass substrates and Through-Glass Via (TGV) technologies emerging as key battlegrounds for 2027. Upstream, German and Japanese suppliers dominate high-purity quartz glass and photoresist markets, while downstream processes rely on Taiwan and South Korean expertise in via drilling and lamination. This shift is reshaping the entire supply chain, with companies in Taiwan, China and South Korea rapidly investing in TGV equipment and materials to seize global market share. Geopolitical tensions are increasing supply chain risks, forcing firms to raise localization rates and incur higher compliance costs. Major players like TSMC, Samsung, and UMC are ramping up capacity to secure customer lock-ins through technological differentiation. Over the next 12–24 months, TGV integration will accelerate in AI packaging, with glass substrate adoption surpassing 30%, establishing new technological moats.