FSC teams with South Korean maker on TGV equipment for glass substrates

FSC’s collaboration with Zhongkechuangfeng to develop TGV equipment for glass substrates signals a strategic push toward advanced packaging localization. This move will accelerate technology upgrades in IC substrates and OSAT sectors across Taiwan, China and Southeast Asia. The integration of plastic injection molding expertise into glass via-hole processes creates a powerful upstream synergy. However, geopolitical tensions and supply chain realignment may intensify export controls on key technologies, raising compliance burdens. Competitors such as Japanese precision machinery firms or South Korean Samsung Electro-Mechanics may respond with accelerated R&D investments to maintain market dominance. Over the next 12–24 months, TGV equipment is poised to become a critical enabler for advanced packaging capacity expansion, especially amid surging demand from 5G and AI chip markets.