Semiconductor News & Analysis Feed
136 articles
2026-05-28
semiengineering.com
2026-05-28
Semiconductor Engineering
Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but which is best to keep?
Despite initial design and verification challenges, chiplet-based architectures are proving to be a cost-effective way of reusing large portions of a design while staying current with the latest I/O protocols and logic.
Early discussions about chiplets
2026-05-28
semiengineering.com
2026-05-28
Semiconductor Engineering
Cerebras’ IPO is a meaningful moment for the semiconductor industry — and not just for the financial implications. Their confidence in their opening price reflects something the industry has effectively acknowledged: incremental chip scaling can no longer keep pace with what AI infrastructure demands. Radical approaches are earning serious consideration and serious capital.
Cerebras’ approach is
2026-05-28
digitimes.com
2026-05-28
Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex AI-driven engineering workflows.
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-27
uk.finance.yahoo.com
2026-05-27
Yahoo Finance UK
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2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages.
Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging.
Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,
2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: Bottlenecks, Trade-offs, and Performance Principles”.
Abstract
“The transition from standard generative AI to reasoning-centric architectures, exemplified by models capable of extensive Chain-of-Thought (CoT) processing, marks a fundamental paradigm shift in system requireme
2026-05-26
www.citybiz.co
2026-05-26
citybiz
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2026-05-26
semiengineering.com
2026-05-26
Semiconductor Engineering
Researchers from Grenoble INP – UGA, CNRS, TIMA have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”.
Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic scaling. While these architectures offer major benefits in terms of modularity, yield, and performance, t
2026-05-25
digitimes.com
2026-05-25
Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies are increasingly turning to advanced packaging and system-level engineering to navigate US semiconductor restrictions.
2026-05-23
interestingengineering.com
2026-05-23
Interesting Engineering
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2026-05-22
www.engineering.com
2026-05-22
Engineering.com
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MAY 22, 2026
Industry News
Axion Semiconductor acquires Moov Technologies
The deal adds equipment marketplace and asset management tools serving semiconductor customers in more than 55 countries.
Axion Semiconductor announced it has acquired Moov Technologies, an Austin, Texas-base
2026-05-22
semiengineering.com
2026-05-22
Semiconductor Engineering
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2026-05-22
news.synopsys.com
2026-05-22
Synopsys
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2026-05-22
newsroom.ucla.edu
2026-05-22
Newsroom | UCLA
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2026-05-22
samueli.ucla.edu
2026-05-22
UCLA Samueli School of Engineering
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2026-05-22
www.digitimes.com
2026-05-22
digitimes
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2026-05-21
semiengineering.com
2026-05-21
Semiconductor Engineering
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2026-05-21
semiengineering.com
2026-05-21
Semiconductor Engineering
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2026-05-21
semiengineering.com
2026-05-21
Semiconductor Engineering
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