Semiconductor News & Analysis Feed
136 articles
2026-06-09
www.engineering.com
2026-06-09
Engineering.com
The deal also covers semiconductor simulation, fab digital twins and tools for autonomous manufacturing workflows.
NVIDIA and SK hynix announced a multiyear technology partnership to advance next-generation memory for the global AI factory buildout and accelerate semiconductor design and manufacturing. The agreement builds on years of deep co-engineering collaboration that has powered some of the
2026-06-09
www.engineering.com
2026-06-09
Engineering.com
The buildout starts at 55 MW, expands GAK Sejong and includes HyperCLOVA X, Nemotron and NemoClaw-based services.
NVIDIA and NAVER announced that NAVER will expand sovereign AI infrastructure, starting at 55 megawatts with plans to move to gigawatt scale using the NVIDIA DSX platform to rapidly design, build and scale full-stack, end-to-end AI platforms that can serve enterprises, industries and
2026-06-09
www.engineering.com
2026-06-09
Engineering.com
www.engineering.com
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2026-06-09
www.engineering.com
2026-06-09
Engineering.com
The architecture uses NeMoClaw, Jetson Thor and IGX Thor for inspection, logistics, energy management and operator support.
Miller Chang, president of Advantech’s Embedded Sector (left), and Deepu Talla, VP and GM of Robotics and Edge AI at NVIDIA (right), announced during the Edge AI conference that the two companies will deepen their collaboration to launch the “AI Factory Brain.”
Advantech ha
2026-06-09
semiengineering.com
2026-06-09
Semiconductor Engineering
Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.
I had the privilege of joining a panel at the Global Semiconductor Alliance (GSA) Tech Summit in June in Scottsdale, Arizona, titled “Collaboration Models That Actually Work.”
It was a fitting title for an event that brought together executives from across the semiconductor ecosystem, i
2026-06-09
www.engineering.com
2026-06-09
Engineering.com
www.engineering.com
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2026-06-09
interestingengineering.com
2026-06-09
Interesting Engineering
From daily news and career tips to monthly insights on AI, sustainability, software, and more—pick what matters and get it in your inbox.
Discover the engineering revolution transforming modern defense with Strength, Stealth, Speed: The Very Fast Future of Advanced Defense
Access expert insights, exclusive content, and a deeper dive into engineering and innovation all with fewer ads or a complet
2026-06-08
www.engineering.com
2026-06-08
Engineering.com
www.engineering.com
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2026-06-08
www.engineering.com
2026-06-08
Engineering.com
The companies plan work in robotics, AI data centers, cooling, 800 V power systems, ADAS and autonomous manufacturing platforms.
LG and NVIDIA are expanding their strategic collaboration across industries, Physical AI, AI Infra and mobility jointly drawing the future map of industry.
On the 8th of June, Kwang Mo Koo, Chairman and CEO of LG Corp.(left) and Jensen Huang, founder and CEO of NVIDIA(
2026-06-08
interestingengineering.com
2026-06-08
Interesting Engineering
From daily news and career tips to monthly insights on AI, sustainability, software, and more—pick what matters and get it in your inbox.
Discover the engineering revolution transforming modern defense with Strength, Stealth, Speed: The Very Fast Future of Advanced Defense
Access expert insights, exclusive content, and a deeper dive into engineering and innovation all with fewer ads or a complet
2026-06-08
www.asiaresearchnews.com
2026-06-08
Asia Research News |
(a) Schematic diagram of twisted bilayer MoS2 (tb-MoS2) forming periodic moiré patterns stacked on top of thickness-dependent semimetal Bi quantum well states (∆E_QWS). The twisted bilayer MoS2 and the Bi metal thin film provide electronic confinement effects parallel and perpendicular to the film plane, respectively, jointly regulating the spatial arrangement of electrons.
(b) Thickness control o
2026-06-06
tomshardware.com
2026-06-06
Zhiye Liu
Hardware leaker shares photographs and benchmarks for Nvidia's GeForce RTX 3050 Ti desktop graphics card that was never released.
2026-06-06
idahonews.com
2026-06-06
KBOI
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From wafers to race cars, students explore engineering at Micron Chip Camp
Micron Chip Camp, a three-day program run in partnership with Micron and Boise State, introduces middle and high school students to semiconductors, engineering, and related technology through a mix of hands-on activities and lessons.
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2026-06-06
idahonews.com
2026-06-06
KBOI
BOISE, Idaho (CBS2) — Inside classrooms at Boise State University, students are spending part of their summer learning how the technology they use every day is built.
Chip Camp, a three-day program run in partnership with Micron and Boise State, introduces middle and high school students to semiconductors, engineering, and related technology through a mix of hands-on activities and lessons.
Stud
2026-06-05
www.engineering.com
2026-06-05
Engineering.com
The agreement adds memory and interface IP, including SerDes, PCIe, UCIe and NVLink-C2C support for AI and HPC designs.
Cadence and Samsung Foundry have announced development of a portfolio of memory and interface IP and expanded certification of Cadence digital, custom, 3D IC and system design and analysis flows for Samsung Foundry’s second-generation 2nm process. The work is intended to support
2026-06-05
semiengineering.com
2026-06-05
Semiconductor Engineering
Computex shows AI ecosystem; fully autonomous chip design; Intel targets AI racks; Nikon’s 1.5 micron L/S litho; IC market rises; Apple’s chiplet era; 4,500 chips per AI server rack; HBM price hikes; quantum IPO, chip and roadmap; SiC guidelines; MXenes; EV outlook; autonomous edge chiplets.
Fig. 2: WSTS forecast summary by region and product segment. Source WSTS
Global |In-Depth |Reports and D
2026-06-05
www.engineering.com
2026-06-05
Engineering.com
www.engineering.com
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2026-06-05
news.google.com
2026-06-05
Semiconductor Engineering
2026-06-05
news.google.com
2026-06-05
UCLA Samueli School of Engineering
2026-06-04
news.google.com
2026-06-04
UC Davis College of Engineering