Semiconductor News & Analysis Feed
605 articles
2026-07-08
www.electronicsweekly.com
2026-07-08
Electronics Weekly
2026-07-07
news.google.com
2026-07-07
Business Wire
2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-07
www.globenewswire.com
2026-07-07
GlobeNewswire
2026-07-07
finance.yahoo.com
2026-07-07
Yahoo Finance
2026-07-07
uk.finance.yahoo.com
2026-07-07
Yahoo Finance UK
2026-07-07
digitimes.com
2026-07-07
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's
2026-07-07
digitimes.com
2026-07-07
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
2026-07-07
digitimes.com
2026-07-07
AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.
2026-07-07
digitimes.com
2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac
2026-07-07
semiengineering.com
2026-07-07
Anne Meixner
Optical methods need to comply with increasing warpage, finer RDL pitch, and trace size.
2026-07-07
www.digitimes.com
2026-07-07
digitimes
2026-07-07
www.newswire.com
2026-07-07
Newswire.com
2026-07-06
news.google.com
2026-07-06
Let's Data Science
2026-07-06
news.google.com
2026-07-06
Tom's Hardware
2026-07-06
news.google.com
2026-07-06
digitimes
2026-07-06
news.google.com
2026-07-06
digitimes
2026-07-06
news.google.com
2026-07-06
Insider Monkey
2026-07-06
digitimes.com
2026-07-06
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging and testing services company under the On Semiconductor (Onsemi) group, using internal funds. The acquisition aims to strengthen the group's overseas operational footprint and improve its global customer service capabi
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.