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Texas Instruments Names Julie Knecht as Next CFO
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Nikita Kumari
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Julie Knecht
June 3, 2026
With more than two decades at the company, Knecht is set to lead financial operations during a key growth period.
Texas Instruments has appointed Julie Knecht as its new Chief Financial Officer, succeeding Rafael Lizardi, who will retire after 25 years with the analog
2026-06-03
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2026-06-03
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2026-06-03
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2026-06-03
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Neil Tyler
03 Jun 2026
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Cadence introduces autonomous AI engineer for chip design workflows
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Cadence Design Systems has announced a new autonomous artificial intelligence (AI) system for semiconductor design, describing it as the industr
2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
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2026-06-02
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02 Jun 2026
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Cadence and Samsung expand partnership for advanced chip design at 2nm
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Cadence Design Systems and Samsung Foundry have announced an expanded collaboration focused on developing advanced semiconductor design tools and intellectual property (IP) for next
2026-06-01
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2026-06-01
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2026-06-01
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2026-06-01
STMicroelectronics
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MASTERGAN6 and MASTERGAN7 help democratize GaN power devices thanks to integrated LDOs and new dedicated pins
Our products Power
June 1, 2026 / 4 minutes of reading /
MASTERGAN6, MASTERGAN7
The MASTERGAN6 and MASTERGAN7 are the first ST GaN power devices to include LDOs, rather than relying on external ones, and the first to offer a hard-switching topology capable of tol
2026-06-01
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2026-06-01
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Infineon Sees India as Key Growth Market for Green-Energy Chips
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Nikita Kumari
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Infineon
June 1, 2026
Driven by rising demand for renewable energy and power management solutions, the chipmaker is expanding investments and local partnerships.
German semiconductor company Infineon Technologies is s
2026-06-01
www.electronicsweekly.com
2026-06-01
Electronics Weekly
Cadence and Samsung Foundry enable 2nd gen 2nm
Cadence and Samsung Foundry have developed a portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic AI digital, custom, 3D‑IC and system design and analysis (SDA) flows for Samsung Foundry’s second-generation 2nm process.
The collaboration delivers a signoff‑ready platform for next‑generation AI infrastructure and phy
2026-06-01
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2026-06-01
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2026-06-01
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2026-06-01
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01 Jun 2026
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Siemens and Samsung Foundry expand collaboration on advanced semiconductor design
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Siemens Digital Industries Software and Samsung Foundry have extended their collaboration to support advanced semiconductor design and manuf
2026-06-01
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2026-06-01
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01 Jun 2026
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Cadence embraces AI to accelerate PCB and system development
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Artificial intelligence has become a central element of Cadence Design Systems’ broader ‘Intelligent System Design’ strategy, reflecting a shif
2026-05-31
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2026-05-31
Korea JoongAng Daily
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2026-05-31
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2026-05-31
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A 12-layer sample of Samsung Electronics' seventh-generation High Bandwidth Memory (HBM4E) / Courtesy of Samsung Electronics
Samsung Electronics became the world's leading supplier of automotive memory chips last year, surpassing U.S. chipmaker Micron, an industry report showed Sunday.
Samsung's share of the global automotive memory chip market rose to 40 percent last year from 35 percent in 202
2026-05-31
www.koreaherald.com
2026-05-31
The Korea Herald
Samsung Electronics’ HBM4E 12-layer product, shipped for the first time in the world, is seen in this photo. (Samsung Electronics)
Samsung Electronics Co. became the world's leading supplier of automotive memory chips last year, surpassing US chipmaker Micron, an industry report showed Sunday.
Samsung's share of the global automotive memory chip market rose to 40 percent last year from 35 percen