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In high-performance computing, data transmission bottlenecks have become a critical constraint limiting chip performance advancement. As Moore's Law approaches physical limits, the industry is exploring new technical approaches to address this challenge. Wafer-level architecture and chiplet solution

The rapid advancement of artificial intelligence technology has brought unprecedented challenges to AI chip design. This article delves into the reality that raw performance specifications in the AI silicon domain only convey a partial picture. While marketing materials emphasize headline figures li

As AI and high-performance computing advance, the demand for efficient data movement between chips and systems is growing. At the IMAPS Memory Summit, experts from Synopsys, Intel, Samsung SSI, and Credo discussed key topics including memory interfaces, interconnect technologies, and memory access s