Semiconductor News & Analysis Feed
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2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
Belgian research hub Imec has taken another step toward high-frequency chiplet-based systems, extending its 300mm RF silicon interposer platform to support system-level integration of III-V chiplets with Si-CMOS technology. The development targets emerging mmWave and sub-THz wireless applications, as well as high-speed signal handling for next-generation data centers.
2026-06-12
www.storyboard18.com
2026-06-12
Storyboard18
Smartphone prices could continue rising well into next year as a worsening shortage of memory chips pushes up manufacturing costs across the industry, according to Nothing co-founder and chief executive Carl Pei.
In a post on X, Pei said memory has become the single most expensive component in modern smartphones, overtaking both processors and displays. In some cases, he noted, memory accounts fo
2026-06-12
eetimes.com
2026-06-12
NoPo scales HiPco single-walled carbon nanotube output for sub-2-nm chips and anodes.
2026-06-12
www.newelectronics.co.uk
2026-06-12
New Electronics
www.newelectronics.co.uk
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2026-06-12
semiengineering.com
2026-06-12
Semiconductor Engineering
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2026-06-12
www.digitimes.com
2026-06-12
digitimes
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
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2026-06-12
seekingalpha.com
2026-06-12
Seeking Alpha
Nvidia pitches new Vera CPUs to Chinese clients, orders set for August: Reuters
Jun 12, 2026, 3:12 AM ETNVIDIA Corporation (NVDA) StockBy: Arundhati Sarkar, SA News Editor
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Nvidia (NVDA) told clients in China that they can start placing orders for its new Vera central processors, which may be available as soon as August, Reuters reported, citing sources.
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2026-06-12
www.theedgesingapore.com
2026-06-12
The Edge Singapore
www.theedgesingapore.com
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2026-06-12
www.theedgesingapore.com
2026-06-12
The Edge Singapore
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2026-06-12
theedgemalaysia.com
2026-06-12
The Edge Malaysia
BERLIN (June 12): Infineon Technologies AG is preparing to open its largest single investment, a €5 billion (US$5.8 billion or RM23.43 billion) semiconductor factory built with the help of European Union subsidies, as the bloc seeks to boost chip production.
The power chip fab, which is an extension of the German company’s Dresden campus, will open on July 2, chief operating officer Alexander Go
2026-06-12
www.reuters.com
2026-06-12
Reuters
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2026-06-12
www.msn.com
2026-06-12
MSN
Infineon Technologies AG (IFNNY) is set to inaugurate its largest-ever standalone investment, a €5B ($5.8 billion) semiconductor manufacturing facility backed by European Union subsidies, as the bloc pushes to strengthen domestic chip production.
The power chip fab, which is an extension of the German company’s Dresden campus, will open on July 2, Chief Operating Officer Alexander Gorski said this
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply chain as demand for advanced AI silicon strains capacity at TSMC.
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2026-06-12
startupfortune.com
2026-06-12
Startup Fortune
Infineon Technologies will open its Smart Power Fab in Dresden on July 2, putting a €5 billion European chip bet behind the power semiconductors AI data centers now need in volume.
The date matters because this is not another distant semiconductor promise. Infineon is bringing its Dresden Smart Power Fab forward from an autumn opening to July 2, 2026, after three years of construction and a deman
2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-12
www.tweaktown.com
2026-06-12
TweakTown
The current memory crisis means that one of the only real ways to ease the burden on the consumer market and meet the insatiable demand from the AI and data center sectors is for key players to ramp up production of existing and next-gen memory chips. As one of the biggest players in the space, SK hynix is looking to do just that and, in the process, triple its wafer production.2VIEW GALLERY - 2 I
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness...
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2026-06-12
www.reuters.com
2026-06-12
Reuters
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2026-06-12
pandaily.com
2026-06-12
Pandaily
categories.technology
China Delivers 5 Million GaN RF Chips for 6G Networks in Breakthrough Commercial Deployment
Published:
June 12, 2026
Reading Time:
2 min read
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China Delivers 5 Million GaN RF Chips for 6G Networks in Breakthrough Commercial Deployment China has delivered five million gallium nitride (GaN) radio freque...
China Delivers 5