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2026-05-29
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2026-05-29
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IREN partners with NVIDIA to develop AI-ready architecture for West Texas data center
IREN partners with NVIDIA to develop AI-ready architecture for West Texas data center campus (IREN)
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2026-05-29
www.tweaktown.com
2026-05-29
TweakTown
NVIDIA's Arm-based 'Vera' CPU benchmarked, beats Intel Xeon and AMD EPYC CPUs
NVIDIA's upcoming 'Vera' CPU delivers a 1.63x performance uplift over last-gen Grace and is also faster than the top EPYC and Xeon CPUs.
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Hassam Nasir
Tech Reporter
Published May 28, 2026 1:25 PM CDT
2 minutes & 45 seconds read time
TL;DR: NVIDIA's Vera CPU, featuring 88 custom Armv9.2 cores and advanced
2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
news.synopsys.com
2026-05-29
Synopsys
SUNNYVALE, Calif., May 28, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 its latest collaborations with Samsung Foundry on advanced nodes, including an expanded portfolio of production‑ready, AI-powered EDA tools, certified interface IP, and silicon-based test capabilities, enabling customers to bring differentiated AI an
2026-05-29
www.datacenterdynamics.com
2026-05-29
Data Center Dynamics
Synopsys has partnered with Samsung Foundry to expand its portfolio of production-ready, AI-powered EDA tools, certified interface IP, and silicon test capabilities.
According to the companies, these new offerings will allow customers to bring AI and multi-die designs to market faster and with “measurably improved” quality.
– Synopsys
The updates were announced during the Samsung Advanced Found
2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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2026-05-29
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Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Provided by PR Newswire May 29, 2026, 1:00:00 AM
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest S
2026-05-29
www.heygotrade.com
2026-05-29
Gotrade
AI Semiconductor Rally: AMD, Marvell, Arista, Nvidia Lead
Rendy Andriyanto
Gotrade Team
28 Mei 2026
Reviewed by Gotrade Internal Analyst
Table of Contents
Key Takeaways
AI Trade Broadens Beyond Nvidia
Arista And AI Networking Infrastructure
Sources
Gotrade News - The AI semiconductor rally is broadening, with AMD, Marvell, Arista, and Nvidia drawing investor attention. The VanEck Semiconductor ET
2026-05-29
www.fool.com
2026-05-29
The Motley Fool
The artificial intelligence (AI) revolution extends far beyond which chip designer makes the best graphics processing units (GPUs). At the core of AI workloads are memory and storage -- the DRAM and high-bandwidth memory (HBM) chips that keep massive training clusters fed with data at high speeds. As data centers scale to support larger AI models, memory demand is shifting from cyclical commodity
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.prnewswire.com
2026-05-29
PR Newswire
Linux Foundation Releases OpenMDW-1.1; NVIDIA Adopts OpenMDW for Cosmos, Isaac GR00T, Ising and Nemotron, AI Model Families
NEWS PROVIDED BY
The Linux Foundation
May 28, 2026, 12:00 ET
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Updated OpenMDW-1.1 license advances open model ecosystem through permissive licensing and intellectual property protections
SAN FRANCISCO, May 28, 2026 /PRNewswire/ -- The Linux Founda
2026-05-28
www.datacenterdynamics.com
2026-05-28
Data Center Dynamics
AI cloud firm Iren has signed a $1.6bn contract with Dell to acquire air-cooled Blackwell systems.
The hardware will be deployed across Iren's existing data centers in Childress, Texas, to enable the neocloud to meet a five-year $3.4bn AI cloud contract the company signed with Nvidia earlier this month.
– Iren
The contract with Nvidia will see Iren provide the chip designer with access to 60MW
2026-05-28
www.forbes.com
2026-05-28
Forbes
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2026-05-28
eeNews Europe
Toshiba has started test-sample shipments of a 1200V trench-gate SiC MOSFET aimed at power supply systems in AI data centres. The TW007D120E is housed in a QDPAK top-side cooled package and is designed to support higher current capability, improved thermal performance and higher power density in the power stage.