Semiconductor News & Analysis Feed

801 articles
2026-06-16
finance.yahoo.com 2026-06-16 Yahoo Finance
Taiwan Semiconductor Manufacturing Company Limited (TSM)’s CEO Expresses Concern About Water, Talent Shortages Ashar Jawad Mon, June 15, 2026 at 11:27 PM PDT 2 min read 2330.TW -1.46% TSM -3.53% Trade TSM on Coinbase Trading disclosure Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is among the 10 Stocks ChatGPT Predicts Could Make You Wealthy in 3 Years. While speaking at a ceremo
2026-06-16
www.tradingkey.com 2026-06-16 TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.barchart.com 2026-06-16 Barchart.com
NVIDIA Corp logo outside building-by BING-JHEN_HONG via iStock Nvidia (NVDA) is back in the bond market for the first time in five years, and the size of the deal is getting attention. The chipmaker is seeking to raise at least $20 billion, with reports saying the final sale could reach $25 billion after strong demand pushed orders to about $85 billion. Nvidia says the proceeds will go toward gen
2026-06-16
www.caledonianrecord.com 2026-06-16 Caledonian Record
PREV Previous PREVIOUS Friday Harbor expands AI pre-underwriting to condo and manuf… - Expansion helps lenders navigate two of mortgage lending's… NEXT Next Up NEXT UP Otovo to Acquire Green Panel for $11 Million to Scale Global Energy Services Pla… OSLO, Norway--(BUSINESS WIRE)--Jun 16, 2026-- AP Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic
2026-06-16
digitimes.com 2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com 2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com 2026-06-16
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according to a report by the Seoul Economic Daily.
2026-06-16
digitimes.com 2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
digitimes.com 2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-16
wmbdradio.com 2026-06-16 1470 & 100.3 WMBD
By Saeed Azhar, Tatiana Bautzer and Zaheer Kachwala June 15 (Reuters) – Nvidia will raise $25 billion through a U.S. bond issuance, more than initially planned, two sources told Reuters on Monday, as it taps the debt market to increase ​liquidity.    Investor demand for the bond sale hit $85 billion, one of the ‌sources familiar with the matter said, declining to be named as the plan was still pr
2026-06-16
eetimes.com 2026-06-16
GlobalFoundries leads with the first silicon to support OCI MSA, shaking up AI data centers.
2026-06-16
www.latimes.com 2026-06-16 Los Angeles Times
The Nvidia Corp. logo during the Computex conference in Taipei, Taiwan, on Wednesday, May 21, 2025. By Brian Smith and Gerson Freitas Jr. June 15, 2026 3 PM PT Chipmaking giant Nvidia Corp. sold $25 billion of high-grade bonds, joining a wave of jumbo debt offerings from tech heavyweights as investors clamor to get exposure to the artificial intelligence boom. The deal, priced on Monday, attract
2026-06-16
www.investing.com 2026-06-16 Investing.com
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2026-06-16
www.cnbc.com 2026-06-16 CNBC
Nvidia is aiming to raise at least $20 billion in debt, according to sources with knowledge of the matter, in the chipmaker’s first bond sale since the start of the AI boom. In a filing with the SEC on Monday, Nvidia disclosed plans for the capital raise but didn’t include the dollar amount. Earlier this year, the chipmaker said it could raise up to $25 billion through issuance of unsecured comm
2026-06-16
www.spokesman.com 2026-06-16 The Spokesman-Review
NEWS NATIONAL BUSINESS Nvidia to raise $20 billion, source says, in first corporate bond sale in five years June 15, 2026 Updated Mon., June 15, 2026 at 8:32 p.m.  Nvidia logo is seen in this illustration taken June 11, 2026.  (Dado Ruvic/Reuters) X Email Reddit By Saeed Azhar and Zaheer Kachwala Reuters Nvidia will raise $20 billion through a U.S. bond issuance, a source told Reuters on Mond
2026-06-16
www.barchart.com 2026-06-16 Barchart.com
Nvidia logo by Konstantin Savusia via Shutterstock Nvidia (NVDA) stock is extending gains on Monday after the artificial intelligence (AI) behemoth revealed plans of raising at least $20 billion via a seven-tranche bond offering — its first since 2021.  Wall Street giants JPMorgan, Goldman Sachs, and Morgan Stanley are leading the sale, with bond maturities extending up to 30 years.  According
2026-06-16
www.ad-hoc-news.de 2026-06-16 AD HOC NEWS
ANSYS Inc., US0357101090 Simulation at scale, Ansys Cloud Direct brings HPC to everyday engineers 15.06.2026 - 20:56:40 | ad-hoc-news.de With Ansys Cloud Direct, the simulation specialist moves high-performance computing from the server room into the engineer’s desktop workflow. The service targets customers who need on-demand cloud capacity without building their own HPC clusters. ANSYS Inc., U
2026-06-16
wccftech.com 2026-06-16 Wccftech
Memory manufacturer Micron could benefit from high DRAM and HBM prices in 2026 and 2027, believes financial firm Aletheia Capital. Micron, like SK hynix and Samsung, has benefited from the strong demand for AI chips in the current buildout as memory production constraints have pushed prices up. The financial firm believes that the value of memory chips in the AI ecosystem will become the most impo
2026-06-16
www.barchart.com 2026-06-16 Barchart.com
NVIDIA Corp logo outside building-by BING-JHEN_HONG via iStock Nvidia (NVDA) has announced a six-year strategic compute collaboration with SharonAI (SHAZ), a neocloud company focused on high-performance computing and artificial intelligence (AI) infrastructure. The deal will enable 72 MW of new data center capacity in Australia, deploying NVDA’s DSX AI factory design and scaling up to 40,000 GB3
2026-06-16
www.mercurynews.com 2026-06-16 The Mercury News
BUSINESS News Nvidia joins AI debt boom with bond sale targeting $20 billion Chipmaking giant Nvidia Corp. is looking to sell at least $20 billion of bonds on Monday, joining a wave of companies that are borrowing as they pay for investments in the artificial intelligence boom By BLOOMBERG | wordpress@medianewsgroup.com | Bloomberg PUBLISHED: June 15, 2026 at 9:09 AM PDT | UPDATED: June 15, 2026 a