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TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. This strategic move signals that next-generation packaging competition is shifting from traditional CoWoS toward more advanced solutions. T

TSMC has partnered with Ibiden and Innolux to advance glass substrate technology for its next-generation CoPoS (Chip-on-Panel-on-Substrate) advanced packaging. This shift from wafer-level to panel-level processing addresses limitations of traditional organic and silicon interposers, particularly in