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Imec researchers argue that co-packaged optics will not be enough for future AI systems, pushing the industry toward 2.5D and eventually 3D optical I/O.

News / Zacks / Can AMKR's 2.5D Packaging Pipeline Drive Long-Term Growth? Can AMKR's 2.5D Packaging Pipeline Drive Long-Term Growth? 3 min read AMKR +2.94% Amkor Technology's AMKR expanding 2.5D packaging pipeline is emerging as a key growth lever as AI and high-performance computing customers shift toward chiplet-based architectures. As semiconductor performance gains increasingly depend on pack

By  Jeong Du-yong Published 2026.06.30. 15:27 Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly

By  Lee Ho-jun Published 2026.06.04. 09:59 HANMI Semiconductor sets up a booth at the 2026 Computex exhibition. /Courtesy of HANMI Semiconductor HANMI Semiconductor took part in Taiwan's Computex for the first time and showcased High Bandwidth Memory (HBM) production equipment and next-generation packaging equipment. HANMI Semiconductor said on the 4th that it participated in "Computex 2026," he

Combining manufacturing-resolution geometry with deterministic, solver-accurate computation changes the economics of thermal analysis for advanced 2.5D packages. Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer,

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators.The article requires paid subscription.Subscribe Now

Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with

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