Semiconductor News & Analysis Feed
20 articles
2026-09-23
2026-09-17
2026-09-11
news.google.com
2026-09-11
2026-09-06
2026-09-03
www.digitimes.com
2026-09-03
Chinese advanced packaging provider SJ Semiconductor (SJSemi) has made a significant advancement in 2.5D packaging technology, expanding its silicon-interposer-based platform to 3.3 times the standard reticle size. This innovation enables denser integration of multiple dies and high-bandwidth memory
2026-08-27
pulse2.com
2026-08-27
Qnity Electronics has launched an integrated materials platform for advanced semiconductor packaging, combining metallization, bumping, dielectric, and fine-line patterning technologies to support increasingly complex AI and high-performance computing architectures. The platform targets next-generat
2026-08-26
eetimes.com
2026-08-26
India is rapidly advancing its semiconductor packaging capabilities, particularly in advanced packaging technologies. ASIP Technologies, in collaboration with South Korean partner APACT, has initiated construction of an outsourced semiconductor assembly and test (OSAT) facility in Visakhapatnam, And
2026-08-21
2026-08-18
semiengineering.com
2026-08-18
2026-08-11
news.google.com
2026-08-11
2026-08-11
news.google.com
2026-08-11
2026-07-02
www.tradingview.com
2026-07-02
Amkor Technology (AMKR) is expanding its 2.5D packaging pipeline, positioning it as a key growth lever amid the industry shift toward chiplet-based architectures driven by AI and high-performance computing. As semiconductor performance increasingly relies on package-level integration rather than tra
2026-06-30
biz.chosun.com
2026-06-30
Hanmi Semiconductor announced the launch of its new 2.5D TC Bonder 40 equipment on June 30, 2026, aimed at supporting advanced packaging processes for AI system semiconductors. Designed specifically for the CoWoS (Chip on Wafer on Substrate) process, the device can handle dies ranging from 3x3 mm to
2026-06-04
biz.chosun.com
2026-06-04
Hanmi Semiconductor made its debut at the 2026 Computex exhibition in Taiwan, showcasing its latest advancements in high-bandwidth memory (HBM) and next-generation 2.5D packaging technologies. The company unveiled the TC Bonder 4 for HBM4 mass production and the Wide TC Bonder, designed to support l
2026-05-27
semiengineering.com
2026-05-27
As high-performance computing and AI accelerators advance, thermal management has emerged as a critical bottleneck in chip packaging. In advanced 2.5D packages, high-power ASICs are integrated with multiple High Bandwidth Memory (HBM) stacks on a silicon interposer, creating tight thermal and mechan
2026-05-12
www.digitimes.com
2026-05-12
TSMC's CoWoS supply constraints are driving industry diversification efforts, particularly pushing SK Hynix and Intel toward collaborative advanced packaging initiatives. This development reflects the semiconductor industry's urgent need for supply chain resilience amid growing demand for AI acceler
2026-05-11
www.tomshardware.com
2026-05-11
Following reports of a partnership between Intel and SK hynix to develop 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology for high-bandwidth memory (HBM) integration, both companies' stock prices surged significantly. SK hynix hit an intraday high of $1,320, up 1
2026-05-11
cryptobriefing.com
2026-05-11
2026-05-11
www.trendforce.com
2026-05-11
SK Hynix is reportedly testing Intel's EMIB 2.5D packaging technology amid TSMC CoWoS supply constraints, highlighting the semiconductor industry's competitive landscape and supply chain diversification needs. EMIB technology enables high-performance, high-density chip integration through silicon in
2026-05-11
www.techpowerup.com
2026-05-11