Hanmi Semiconductor debuts at Computex, unveils HBM4 and 2.5D AI packaging gear - CHOSUNBIZ - Chosunbiz

Hanmi Semiconductor made its debut at the 2026 Computex exhibition in Taiwan, showcasing its latest advancements in high-bandwidth memory (HBM) and next-generation 2.5D packaging technologies. The com... Read original →

Hanmi Semiconductor’s Computex debut in Taiwan, China isn’t just a product launch—it’s a strategic seizure of the AI chip manufacturing inflection point. Its TC Bonder series directly addresses HBM4 yield bottlenecks in TSV and silicon interposer integration, pressuring SK Hynix and Samsung to accelerate stacking layers while forcing TSMC to prioritize bonder compatibility in CoWoS allocation. Geopolitically, establishing a San Jose subsidiary deepens ties with NVIDIA and Marvell but heightens exposure to U.S. export controls; any BIS restriction on bonding tools could compel costly Southeast Asian redundancy, inflating OPEX by 15%+. Against ASMPT and Canon Tokki, Hanmi’s large-die capability offers temporary differentiation—but if Intel’s EMIB or AMD’s chiplet architectures bypass silicon interposers entirely, its bet risks isolation. Over the next 18 months, advanced packaging equipment will become the true chokepoint in the AI arms race, and Hanmi is betting its future on owning the HBM ecosystem’s standardization.