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EUV53 3nm45 AI15 GPU14 HBM10 DRAM9 AI chips7 2nm7 DDR56 EPYC6 AI chip5 semiconductor5 Zen 65 HBM44 AI accelerators4
2026-05-17
Taiwan chipmakers quietly fill gaps left by Korea's HBM push
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digitimes.com 2026-05-17
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology is now rippling into legacy memory, packaging, and testing.
2026-05-17
Galatek targets advanced packaging market, eyes Taiwan foundries
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digitimes.com 2026-05-17
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.
2026-05-17
Galatek targets advanced packaging market, eyes Taiwan foundries - digitimes
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www.digitimes.com 2026-05-17 digitimes
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2026-05-16
Can India Build an Advanced Semiconductor Packaging Ecosystem? - Bisinfotech
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www.bisinfotech.com 2026-05-16 Bisinfotech
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2026-05-16
SK Hynix’s Packaging Pivot: Why EMIB Could Reshape the HBM Supply Chain - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-16 AD HOC NEWS
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2026-05-16
Exynos 2700 To Receive Premium Treatment From Samsung As Update Drops Claims Of Company Abandoning Its 2nm SoC’s Advanced Packaging - Wccftech
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wccftech.com 2026-05-16 Wccftech
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2026-05-15
SMIC Shuffles Capacity to Meet Higher Power and Analog Chip, and Advanced Packaging AI Demand - Morningstar
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www.morningstar.com 2026-05-15 Morningstar
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2026-05-15
Taiwan Semi Accelerates 2nm And AI Packaging Push - Benzinga
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www.benzinga.com 2026-05-15 Benzinga
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2026-05-15
Why the Semiconductor Advanced Packaging Market Is Growing Faster Than Chipmakers Expected - openPR.com
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www.openpr.com 2026-05-15 openPR.com
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2026-05-15
SK Hynix Pushes Past Packaging Logjam as HBM Capacity Is Spoken For Through 2026 - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
Taiwan: TSMC unveils advanced packaging breakthroughs and 2nm roadmap at Symposium - lokmattimes.com
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www.lokmattimes.com 2026-05-15 lokmattimes.com
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2026-05-15
Taiwan: TSMC unveils advanced packaging breakthroughs and 2nm roadmap at Symposium - english.punjabkesari.com
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english.punjabkesari.com 2026-05-15 english.punjabkesari.com
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2026-05-15
Taiwan: TSMC unveils advanced packaging breakthroughs and 2nm roadmap at Symposium - ANI News
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www.aninews.in 2026-05-15 ANI News
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2026-05-15
Malaysia's Arm-backed chip push lifts Oppstar, SkyeChip as startup ambitions expand beyond packaging
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digitimes.com 2026-05-15
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
2026-05-14
LPKF Laser's New Board Member from Elmos: A Bet on Advanced Packaging Over Near-Term Pain - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-14 AD HOC NEWS
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2026-05-14
TSMC touts advanced packaging, 2nm progress at tech symposium - Focus Taiwan
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focustaiwan.tw 2026-05-14 Focus Taiwan
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2026-05-14
TSMC symposium spotlights AI expansion, advanced packaging demand - digitimes
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www.digitimes.com 2026-05-14 digitimes
TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute...The article requires paid subscription.Subscribe Now
TSMCArtificial IntelligenceSemiconductorAdvanced ProcessAI ChipsCloud ComputingEdge ComputingWafer Manufacturing
2026-05-14
AI Chip Revolution Drives Advanced Packaging Market Toward $116 Billion by 2035 - TimesTech
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timestech.in 2026-05-14 TimesTech
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2026-05-14
LPKF Laser: Restructuring Meets Rally as All Eyes Turn to Advanced Packaging - AD HOC NEWS
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www.ad-hoc-news.de 2026-05-14 AD HOC NEWS
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2026-05-14
Samsung reportedly speeds up 3D NAND, packaging, and substrate plans - digitimes
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www.digitimes.com 2026-05-14 digitimes
Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after more than a year of prioritizing DRAM design and...The article requires paid subscription.Subscribe Now
Samsung Electronics3D NANDAdvanced PackagingSemiconductor ManufacturingFlash MemoryCompound SemiconductorsSubstrate TechnologyDRAM Design