Semiconductor News & Analysis Feed
536 articles
2026-07-01
digitimes.com
2026-07-01
South Korea's government laid out a detailed plan on June 30 for building its southwest region into a major new semiconductor production base, with SK, Samsung Electronics and Amkor outlining a combined KRW896 trillion (approx. US$581 billion) in investment covering memory chip fabs, AI data centers and advanced packaging.
2026-07-01
digitimes.com
2026-07-01
Cloud AI demand is reshaping the seasonal cycle of the semiconductor industry, with capacity tightness spreading from front-end manufacturing to back-end packaging and testing. Since late 2025, outsourced semiconductor assembly and test, or OSAT, capacity has tightened steadily. New capacity added in 2026 has also been filled quickly, prompting multiple IC design houses to lock in capacity and pus
2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-07-01
www.indexbox.io
2026-07-01
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2026-07-01
finance.yahoo.com
2026-07-01
Yahoo Finance
TSMC targets 2029 for panel-level CoPoS packaging in AI chip push - DigiTimes
Luke Juricic
June 30, 2026 4 min read
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Investing.com -- Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafe
2026-07-01
simplywall.st
2026-07-01
simplywall.st
United States/Semiconductors/NYSE:TSM
TSMC (NYSE:TSM) And Amkor Sign 10 Year Arizona Chip Packaging Deal
July 01, 2026
Simply Wall St
Reviewed by Bailey Pemberton
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TSMC and Amkor have agreed to a 10 year partnership focused on advanced semiconductor packaging and testing in Arizona.
The collaboration is aimed at supporting US chip supply for AI and high performance computing applica
2026-07-01
www.investing.com
2026-07-01
Investing.com
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2026-06-30
news.google.com
2026-06-30
EDN - Voice of the Engineer
2026-06-30
www.indexbox.io
2026-06-30
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2026-06-30
www.thelec.net
2026-06-30
thelec.net
Applied Materials’ enhanced Centura Prime Epi system (Photo=Applied Materials)
Applied Materials has introduced six new semiconductor manufacturing systems for DRAM and advanced packaging, expanding its portfolio of 3D semiconductor equipment aimed at improving the performance and power efficiency of next-generation memory used in artificial intelligence (AI) processors.
The company unveiled
2026-06-30
www.digitimes.com
2026-06-30
digitimes
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven...
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2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
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2026-06-30
www.digitimes.com
2026-06-30
digitimes
As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals giant DuPont and separately listed — is likewise expanding its production capacity investment in Taiwan. Asia-Pacific president...
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2026-06-30
biz.chosun.com
2026-06-30
Chosunbiz
By
Jeong Du-yong
Published 2026.06.30. 15:27
Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor
HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly
2026-06-30
www.mk.co.kr
2026-06-30
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2026-06-30
digitimes.com
2026-06-30
AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs, tightening capacity across both 8-inch mature processes and 12-inch advanced nodes. CoWoS's advanced packaging and HBM capacity are also set for a prolonged supply shortage, effectively rewriting the foundry industry's business cycle.
2026-06-30
digitimes.com
2026-06-30
As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating its push into 2nm-and-below nodes as well as advanced packaging technologies such as CoWoS. Industry sources said the AI-driven investment wave is now spreading beyond foundries into the equipment, materials, factory engineering, and inspection supply chains.
2026-06-30
digitimes.com
2026-06-30
TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to use a new "round-to-square" architecture to break through cost and capacity bottlenecks in large AI chip packaging and build its next competitive moat.
2026-06-30
digitimes.com
2026-06-30
Qnity, the independent company spun off from US chemicals giant DuPont, is ramping up investment in Taiwan as the island cements its role at the center of the global AI hardware supply chain. Asia-Pacific president Dennis Chen said in an interview with DIGITIMESthat future spending will focus on three main battlegrounds: advanced packaging, co-packaged optics (CPOs), and thermal management.
2026-06-30
www.tradingview.com
2026-06-30
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ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
ASE Technology vs. Amkor: Which Chip Packaging Stock Is the Better Buy?
5 min read
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Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor packaging, making outsourced semiconductor assembly and test (OSAT) providers increas