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United States/Semiconductors/NasdaqGS:AMAT
Will Broadcom Joining EPIC Platform Reshape Applied Materials' (AMAT) Advanced Packaging and AI Narrative?
May 23, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
Earlier in May 2026, Applied Materials reported second-quarter sales of US$7.91 billion and net income of US$
2026-05-23
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2026-05-23
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2026-05-22
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Electronics For You BUSINESS
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2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced
2026-05-22
digitimes.com
2026-05-22
Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome
2026-05-22
digitimes.com
2026-05-22
AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.
2026-05-22
digitimes.com
2026-05-22
Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.
2026-05-22
digitimes.com
2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-22
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2026-05-22
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2026-05-22
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