Semiconductor News & Analysis Feed

11 articles
2026-09-29
www.kucoin.com 2026-09-29
2026-09-08
www.kucoin.com 2026-09-08
OpenAI's release of its new model, Astra, has sparked significant market attention on memory chip demand. Positioned as a flagship model for complex, multi-step professional tasks, Astra emphasizes reasoning, programming, research, and end-to-end task execution—capabilities that significantly increa
2026-08-28
www.kucoin.com 2026-08-28
2026-08-12
www.kucoin.com 2026-08-12
2026-08-11
www.kucoin.com 2026-08-11
At the 2026 Next-Generation Lithography + Patterning Academic Conference, Samsung confirmed that it plans to adopt High-NA EUV as its primary manufacturing technology starting from the 1nm (A10) node around 2030. Prior to this, nodes such as 2nm, 1.4nm, and early 1nm will continue to rely on 0.33 NA
2026-08-11
www.kucoin.com 2026-08-11
This article explores how storage technologies are evolving in the era of AI agents, fundamentally reshaping data processing paradigms. As AI agents transition from single model invocations to continuous operating systems, their data handling becomes increasingly complex, involving observation, reas
2026-08-10
news.google.com 2026-08-10
2026-07-21
www.kucoin.com 2026-07-21
2026-07-09
www.kucoin.com 2026-07-09
Morgan Stanley's latest AI supply chain report forecasts that global CoWoS demand will surge to 2.694 million wafers by 2027, up 93% from 1.394 million in 2026. While NVIDIA remains the largest user at 45%, AMD is emerging as a key growth driver with a 308% increase. Notably, AMD’s first CPU to use
2026-06-23
www.kucoin.com 2026-06-23
The Chinese embodied intelligence chip market is heating up with new collaborations and product launches. Muxi Co. Ltd. and UBTECH have signed a strategic agreement to jointly establish a new company focused on the R&D and mass production of embodied intelligence edge chips, with the first chip expe
2026-06-22
www.kucoin.com 2026-06-22
Intel CEO Chen Liwu has set a bold 10x return target for Intel over the next 5–10 years, focusing on advanced packaging, novel semiconductor materials, and next-generation substrate technologies. As traditional process scaling faces physical limitations, Chen emphasizes a strategic pivot toward mate