Semiconductor News & Analysis Feed
17 articles
2026-07-02
digitimes.com
2026-07-02
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies, drawing on system-on-chip (SoC) development work the company has done for its own products since the early 2000s, according to industry sources cited by ZDNet Korea. LG declined to confirm the report when contacted.
2026-06-25
wccftech.com
2026-06-25
Wccftech
Qualcomm is expanding its chip-design services to China as it is reportedly in early talks with ByteDance.
Custom-chip designs are picking up momentum across the tech industry, and a report by Reuters suggests that Qualcomm might be assisting ByteDance, a leading Chinese firm, with chip-design services.
Although the talks between Qualcomm and ByteDance are still early, if they succeed, then that
2026-06-24
www.businesstimes.com.sg
2026-06-24
The Business Times
Qualcomm in talks to provide custom chip-design services to ByteDance: sources
The negotiations show US tech companies are keen to do business with China, even with growing friction over AI chips
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Published Wed, Jun 24, 2026 · 07:36 PM
Qualcomm is the world’s largest supplier of smartphone modem chips, which manage cellular communications. PHOTO: REU
2026-06-24
www.ceoinsightsasia.com
2026-06-24
CEO Insights Asia
Qualcomm is negotiating to offer chip-design services to China's ByteDance, as the US firm aims to lessen its reliance on the smartphone market, its primary revenue generator, according to reports.
If the negotiations succeed, ByteDance, the owner of the short-video app TikTok, will become one of the first clients of Qualcomm's chip-design services division.
Qualcomm is the leading provider of m
2026-06-24
www.benzinga.com
2026-06-24
Benzinga
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2026-06-24
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2026-06-24
GuruFocus
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2026-06-24
seekingalpha.com
2026-06-24
Seeking Alpha
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2026-06-24
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2026-06-24
Investing.com
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2026-06-24
www.reuters.com
2026-06-24
Reuters
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2026-06-24
uk.finance.yahoo.com
2026-06-24
Yahoo Finance UK
Qualcomm in talks to provide custom chip-design services to ByteDance, sources say
AI Impact Summit in New Delhi · Reuters
Reuters
Tue, 23 June 2026 at 9:36 pm GMT-7 2 min read
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June 24 (Reuters) - Qualcomm is in talks to provide chip-design services to China's ByteDance, four people familiar with the matter said, as the U.S. company seeks to reduce
2026-06-24
www.marketscreener.com
2026-06-24
marketscreener.com
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2026-06-24
www.tradingview.com
2026-06-24
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Qualcomm in talks to provide custom chip-design services to ByteDance, sources say
Qualcomm in talks to provide custom chip-design services to ByteDance, sources say
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2026-06-24
digitimes.com
2026-06-24
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
2026-06-11
pulse2.com
2026-06-11
Pulse 2.0
QBit Semiconductor announced the acquisition of a 60% stake in Singapore-based SinChip Technology, expanding its ASIC design services capabilities and strengthening its presence in high-growth markets, including Edge AI, high-performance computing, optical communications, and automotive semiconductors.
The transaction, completed on June 5, gives QBit operational control of SinChip, which will be
2026-06-10
digitimes.com
2026-06-10
QBit Semiconductor said it will buy a 60% stake in Singapore-based Sinchip Technology, a move that gives it control of the company and expands its reach across major chip markets. The deal could affect global demand for customized semiconductors used in AI, computing, communications, and vehicles.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-26
digitimes.com
2026-05-26
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices as part of an end-to-end offering for AI chips, addressing rising demand for GenAI and high-performance computing for memory capacity, bandwidth, and energy efficiency. The firm said it is leveraging its combined lo