Semiconductor News & Analysis Feed
944 articles
2026-06-25
bits-chips.com
2026-06-25
Bits&Chips
Headline
Japanese researcher proposes simpler high-NA EUV optics design
25 June 2026
Paul van Gerven
Editor at Bits&Chips
Reading time: 1 minute
A researcher at the Okinawa Institute of Science and Technology (OIST) has proposed a new optical architecture for high-NA EUV lithography. The approach replaces today’s highly complex optical layouts with a simpler in-line configuration that uses carefu
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
news.google.com
2026-06-25
Stock Titan
2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
AMAT
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Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
tomshardware.com
2026-06-25
Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
www.forbes.com
2026-06-25
Forbes
INNOVATION
AI
Whoever Wins AI Will Count Transformers, Not Nvidia Chips
ByRobert J. Szczerba,
Contributor.
Robert J. Szczerba is a tech CEO covering AI, robotics and automation
Follow Author
Jun 25, 2026, 06:15am EDT
Summary
The US AI buildout faces a critical bottleneck: not chips, but power infrastructure. Half of planned 2026 data centers are stalled due to shortages of transformers, switc
2026-06-25
eetimes.com
2026-06-25
IBM unveils 0.7-nm nanostack chips promising 100 billion transistors, denser SRAM, and production within five years.
2026-06-25
www.reuters.com
2026-06-25
Reuters
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2026-06-25
www.bloomberg.com
2026-06-25
Bloomberg
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Get the most important global
2026-06-25
digitimes.com
2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.
2026-06-25
digitimes.com
2026-06-25
ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet for China's domestic AI chip industry.
2026-06-25
digitimes.com
2026-06-25
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density memory and automotive electronics.
2026-06-25
semiengineering.com
2026-06-25
Liz Allan
Physical I/Os can be a chokepoint for high-performance chips and high-speed interconnec...
2026-06-25
digitimes.com
2026-06-25
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.
2026-06-25
digitimes.com
2026-06-25
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains for silicon photonics (SiPh), AI servers, and advanced chips are tightening, while new capacity is expected to ease bottlenecks and shape revenue growth in 2026 and 2027.
2026-06-25
digitimes.com
2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
2026-06-25
digitimes.com
2026-06-25
Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone business and challenge Nvidia's dominance — while courting Chinese demand and leaning on manufacturing partner TSMC.
2026-06-25
timesofsandiego.com
2026-06-25
Times of San Diego
Qualcomm President and CEO Cristiano Amon speaks on Wednesday. (Photo from Qualcomm live stream)
Qualcomm‘s stock rose as much as 15% in after-hours trading Wednesday after it announced a deal to supply Facebook-parent Meta with AI chips.
The San Diego-based wireless pioneer said its new Dragonfly C1000 chip will power Meta’s next generation of data centers.
“We’re excited to continue partnerin
2026-06-25
www.ft.com
2026-06-25
Financial Times
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