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Chinese chip packaging and testing giant JCET plans to invest 7.8 billion yuan (US$1.15 billion) to build a new advanced packaging and testing facility in Shanghai's Lingang Special Area. This move comes amid rapid growth in domestic chip demand driven by artificial intelligence development. The pro

Chinese chip packaging leader JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang. This strategic move strengthens JCET's capacity for AI computing, high-performance chips, and