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Semiconductors Tech China’s JCET to build new plant in Shanghai to expand advanced chip packaging US$1.15 billion investment underscores advanced packaging’s role in boosting China’s chipmaking capabilities amid rapid AI development 2-MIN READ 0 Listen Make SCMP preferred on Google Xinmei Shen Published: 8:30am, 25 Jun 2026 Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics

JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing, power modules, and next-generation data centers.