JCET forecasts higher first-half profit on AI-driven chip demand

JCET's profit uptick signals AI infrastructure demand cascading into advanced packaging—a structural shift, not a cyclical blip. Technically, surging HBM and CoWoS orders are forcing OSATs to fast-track 2.5D/3D integration, straining silicon interposer and ABF substrate supplies upstream while enabling GPU makers to bypass transistor scaling limits downstream. On compliance, though U.S. export controls haven’t fully targeted Chinese OSATs yet, looming restrictions on assembly/test tools are inflating localization costs and buffer inventories. Rivals like ASE and Amkor will accelerate Mexico/India expansions to serve U.S. clients, while JCET leverages STATS ChipPAC’s Singapore hub for geopolitical hedging. Within 18 months, packaging will evolve from back-end support to front-end architecture definition—firms mastering chiplet interconnect standards will dictate ecosystem control, driving industry consolidation.